18652022. CHIP ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)

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CHIP ELECTRONIC COMPONENT

Organization Name

Murata Manufacturing Co., Ltd.

Inventor(s)

Masakiyo Nagatomo of Nagaokakyo-shi (JP)

Keisuke Isogai of Nagaokakyo-shi (JP)

Yoshinobu Saki of Nagaokakyo-shi (JP)

CHIP ELECTRONIC COMPONENT - A simplified explanation of the abstract

This abstract first appeared for US patent application 18652022 titled 'CHIP ELECTRONIC COMPONENT

The abstract of the patent application describes a chip electronic component with a ceramic body containing a semiconductor ceramic with an oxide including Ti and Ba, and a solid metal electrode in ohmic contact with the ceramic body. The component must meet specific size and stress criteria.

  • The chip electronic component must have a surface area of the solid metal electrode (A) to volume of the ceramic body (V) ratio of at least 3.3 (mm/mm).
  • The solid metal electrode must have a film stress of about 140 MPa or more.
  • The ceramic body includes a semiconductor ceramic with an oxide containing Ti and Ba.
  • The solid metal electrode is located at one end of the ceramic body and is in ohmic contact with it.

Potential Applications: - This technology can be used in various electronic devices such as sensors, actuators, and transducers. - It can also be applied in telecommunications equipment and automotive systems.

Problems Solved: - Provides a reliable and efficient electronic component with specific size and stress requirements. - Ensures a stable and durable connection between the ceramic body and the solid metal electrode.

Benefits: - Improved performance and longevity of electronic devices. - Enhanced reliability and stability in electronic components.

Commercial Applications: Title: Advanced Chip Electronic Component for High-Performance Devices This technology can be utilized in the manufacturing of high-performance electronic devices, leading to improved functionality and durability. The market implications include increased demand for reliable electronic components in various industries.

Questions about Chip Electronic Component Technology: 1. How does the composition of the ceramic body contribute to the performance of the chip electronic component? The composition of the ceramic body, including the semiconductor ceramic with Ti and Ba oxides, enhances the conductivity and stability of the component, ensuring efficient operation.

2. What are the key factors to consider when designing and manufacturing chip electronic components for optimal performance? Design and manufacturing considerations include the size and stress criteria, material composition, and the quality of the connection between the ceramic body and the solid metal electrode.


Original Abstract Submitted

A chip electronic component includes a ceramic body that includes a semiconductor ceramic including an oxide including Ti and Ba, and a solid metal electrode at an end of the ceramic body and in ohmic contact with the ceramic body. The chip electronic component satisfies: A/V≥3.3 (mm/mm), where A (mm) is a surface area of the solid metal electrode, and V (mm) is a volume of the ceramic body, and a film stress of the solid metal electrode is about 140 MPa or more.

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