18651840. IMAGE SENSOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
IMAGE SENSOR PACKAGE
Organization Name
Inventor(s)
Dong Hoon Kang of Hwaseong-si (KR)
IMAGE SENSOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18651840 titled 'IMAGE SENSOR PACKAGE
The image sensor package described in the patent application consists of several key components:
- Solder resist layer wrapping a redistribution layer and a connection pad
- Mold layer with inner and outer walls defining a sensor array region
- Logic chip and image sensor chip in the sensor array region, contacting the mold layer
- Transparent substrate spaced apart from the image sensor chip
- Adhesive layer between the transparent substrate and the mold layer
Key Features and Innovation:
- Integration of multiple layers and components to create a compact and efficient image sensor package
- Use of a mold layer to define the sensor array region and provide structural support
- Placement of logic chip and image sensor chip within the sensor array region for optimal performance
- Incorporation of a transparent substrate for protection and support
- Adhesive layer for secure attachment and alignment of components
Potential Applications:
- Mobile devices such as smartphones and tablets
- Digital cameras and camcorders
- Automotive cameras for advanced driver assistance systems (ADAS)
- Surveillance cameras and security systems
- Medical imaging equipment
Problems Solved:
- Ensuring proper alignment and connection of components in an image sensor package
- Providing structural support and protection for delicate chips and layers
- Optimizing space and layout for compact and efficient design
- Facilitating mass production and assembly of image sensor packages
- Enhancing performance and reliability of image sensor systems
Benefits:
- Improved image quality and resolution in electronic devices
- Compact and durable design for various applications
- Enhanced functionality and performance of image sensor packages
- Simplified manufacturing and assembly processes
- Increased reliability and longevity of image sensor systems
Commercial Applications:
- The technology can be utilized in the consumer electronics industry for the production of smartphones, digital cameras, and other imaging devices. The compact and efficient design of the image sensor package can lead to cost savings and improved performance in these products.
Questions about the Image Sensor Package: 1. How does the mold layer contribute to the overall functionality of the image sensor package? 2. What are the potential challenges in mass-producing image sensor packages with this design?
Original Abstract Submitted
An image sensor package includes: a solder resist layer wrapping a redistribution layer and a connection pad; a mold layer on the solder resist layer and including an inner wall and an opposing outer wall, the inner wall defining a sensor array region; a logic chip on the solder resist layer and in the sensor array region, and contacting the mold layer; an image sensor chip on the logic chip and in the sensor array region, and contacting the mold layer; a transparent substrate spaced apart from the image sensor chip in a first direction; and an adhesive layer disposed between the transparent substrate and the mold layer. The mold layer includes a third face and a fourth face opposite to each other and connecting the inner wall and the outer wall. The fourth face of the mold layer does not overlap the image sensor chip in the first direction.
