18651064. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Ryotaro Kakizaki of Kyoto-shi (JP)
Yasumasa Kasuya of Kyoto-shi (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18651064 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract includes a semiconductor element, a first lead with a die pad portion and a first terminal portion, and a sealing resin. The first lead reverse surface is exposed from a second resin surface and spaced apart from a third resin surface in a first direction. The first terminal portion consists of a first portion and a second portion, with only one set of the first portion passing through the third resin surface. The first portion is spaced apart from the second resin surface in a z direction, while the second portion is located on a first side in the z direction relative to the first portion and used for mounting.
- Semiconductor device with a unique lead design for improved functionality
- Sealing resin for protection and insulation of internal components
- Specific positioning of lead portions for efficient mounting and connection
- Enhanced durability and reliability of the semiconductor device
- Innovative design elements for optimal performance
Potential Applications: - Electronics manufacturing - Semiconductor industry - Consumer electronics - Automotive technology
Problems Solved: - Improved lead design for better connectivity - Enhanced protection of internal components - Efficient mounting and assembly process
Benefits: - Increased reliability of semiconductor devices - Enhanced performance and durability - Simplified manufacturing processes
Commercial Applications: Title: Innovative Semiconductor Device Lead Design for Enhanced Performance This technology can be utilized in various industries such as electronics manufacturing, semiconductor production, consumer electronics, and automotive technology. The unique lead design and sealing resin offer improved functionality, durability, and reliability, making it a valuable addition to the market.
Questions about Semiconductor Device Lead Design: 1. How does the unique lead design of the semiconductor device improve its performance? The unique lead design of the semiconductor device enhances connectivity, reliability, and efficiency in mounting and assembly processes, leading to improved overall performance.
2. What are the potential applications of this semiconductor device technology? The potential applications of this semiconductor device technology include electronics manufacturing, semiconductor industry, consumer electronics, and automotive technology, where the innovative lead design and sealing resin can offer enhanced functionality and durability.
Original Abstract Submitted
A semiconductor device includes: a semiconductor element; a first lead including a die pad portion and a first terminal portion; and a sealing resin. A first lead reverse surface is exposed from a second resin surface and spaced apart from a third resin surface in a first direction. The first terminal portion includes a first portion and a second portion. Only one set of the first portion passes through the third resin surface. The first portion is spaced apart from the second resin surface in a z direction. The second portion is located on a first side in the z direction relative to the first portion and used for mounting.
