18650918. CIRCUIT MODULE simplified abstract (Murata Manufacturing Co., Ltd.)
Contents
CIRCUIT MODULE
Organization Name
Murata Manufacturing Co., Ltd.
Inventor(s)
Tsuyoshi Takakura of Kyoto (JP)
Masaaki Mizushiro of Kyoto (JP)
Hiroki Yoshimori of Kyoto (JP)
Yoshihito Otsubo of Kyoto (JP)
CIRCUIT MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18650918 titled 'CIRCUIT MODULE
The circuit module described in the patent application includes a substrate with a resin layer, an electronic component, a penetrating portion, a first conductor, and a second conductor.
- The substrate has a resin layer on its first main surface.
- The electronic component is integrated into the circuit module.
- The penetrating portion penetrates the resin layer in a thickness direction.
- The first conductor, a pillar conductor, is present in the penetrating portion.
- The first conductor includes a first bottom closer to the substrate and a second bottom inward of the resin layer's outer surface.
- The second conductor, a metal film, covers at least a portion of a side surface of the first conductor.
- The second conductor extends continuously from the side surface of the first conductor to the same plane as the outer surface of the resin layer.
Potential Applications: This technology can be used in various electronic devices and systems that require compact and efficient circuit modules.
Problems Solved: This innovation addresses the need for improved circuit modules with enhanced connectivity and space-saving design.
Benefits: The circuit module offers increased reliability, improved performance, and reduced size, making it ideal for modern electronic applications.
Commercial Applications: This technology has potential commercial uses in consumer electronics, telecommunications, automotive systems, and industrial equipment.
Questions about the Circuit Module: 1. How does the resin layer impact the performance of the circuit module?
The resin layer provides insulation and protection for the electronic components, ensuring reliable operation.
2. What advantages does the pillar conductor design offer in this circuit module?
The pillar conductor design allows for efficient signal transmission and space optimization within the module.
Original Abstract Submitted
A circuit module includes: a substrate including a first main surface and a second main surface; a resin layer on the first main surface of the substrate; an electronic component; a penetrating portion penetrating the resin layer in a thickness direction; a first conductor that is a pillar conductor present in the penetrating portion, the first conductor including a first bottom closer to the substrate and a second bottom inward of an outer surface of the resin layer; a second conductor that is a metal film covering at least a portion of a side surface of the first conductor, the second conductor including a portion extending continuously from the side surface of the first conductor to the same plane with the outer surface of the resin layer.
