18650794. SEMICONDUCTOR PACKAGE simplified abstract (ROHM CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18650794 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of a die pad, a semiconductor device with a chip, main surface electrode, terminal electrode, sealing insulator, and a package body.
- The sealing insulator covers the periphery of the terminal electrode on the main surface, leaving a part of the terminal electrode exposed.
- The package body seals the die pad and the semiconductor device, covering the sealing insulator.
- The sealing insulator includes a first matrix resin and first fillers, while the package body consists of a second matrix resin and second fillers.
Potential Applications:
- This technology can be used in various electronic devices such as smartphones, tablets, and computers.
- It can also be applied in automotive electronics, medical devices, and industrial equipment.
Problems Solved:
- Provides protection for the terminal electrode on the semiconductor device.
- Ensures proper sealing and insulation for the semiconductor package.
Benefits:
- Enhanced durability and reliability of electronic devices.
- Improved performance and longevity of semiconductor components.
Commercial Applications:
- This technology can be utilized by semiconductor manufacturers, electronics companies, and other industries requiring reliable packaging solutions for their products.
Questions about the technology: 1. How does the sealing insulator contribute to the overall protection of the semiconductor device? 2. What are the specific advantages of using a package body with second matrix resin and fillers in this semiconductor package design?
Original Abstract Submitted
A semiconductor package includes a die pad, a semiconductor device that is arranged on the die pad, and that has a chip having a main surface, a main surface electrode arranged on the main surface, a terminal electrode arranged on the main surface electrode, and a sealing insulator including a first matrix resin and first fillers, and covering a periphery of the terminal electrode on the main surface such as to expose a part of the terminal electrode, and a package body that includes a second matrix resin and second fillers, and that seals the die pad and the semiconductor device such as to cover the sealing insulator.
