18650641. SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS simplified abstract (SK hynix Inc.)

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS

Organization Name

SK hynix Inc.

Inventor(s)

Jin Kyoung Park of Icheon-si Gyeonggi-do (KR)

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18650641 titled 'SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS

The semiconductor package described in the abstract consists of a base layer with two chip stacks stacked on top of it. Each chip stack contains multiple semiconductor chips that are offset stacked to expose chip pads on one side edge. These chip pads include stack identification pads for distinguishing between the first and second chip stacks, as well as chip identification pads for identifying the individual chips within each stack.

• The package includes inter-chip wires connecting the chip identification pads of the semiconductor chips in each stack that have power applied to them.
• Additionally, there are stack wires connecting the chip identification pad of the bottom semiconductor chip in each stack to the base layer.

• • Key Features and Innovation:**
• Offset stacking of semiconductor chips to expose chip pads.
• Inclusion of stack identification pads and chip identification pads on the chip pads.
• Inter-chip wires and stack wires for connecting the chip identification pads.

• • Potential Applications:**
• Semiconductor packaging for electronic devices.
• Integrated circuits in consumer electronics.
• Microprocessors in computing devices.

• • Problems Solved:**
• Efficient identification and connection of semiconductor chips in a package.
• Improved power distribution within the package.

• • Benefits:**
• Enhanced functionality and reliability of semiconductor packages.
• Simplified assembly and maintenance of electronic devices.

• • Commercial Applications:**
• This technology could be used in the production of smartphones, tablets, and other portable electronic devices. It could also find applications in the automotive industry for advanced driver assistance systems and in the healthcare sector for medical devices.

• • Questions about Semiconductor Package Technology:**

1. How does the offset stacking of semiconductor chips benefit the overall design of the package? 2. What are the advantages of using stack identification pads and chip identification pads in semiconductor packages?

• • Frequently Updated Research:**

Ongoing research in semiconductor packaging focuses on improving the efficiency and performance of integrated circuits in electronic devices. Researchers are exploring new materials and designs to enhance the capabilities of semiconductor packages.

Original Abstract Submitted

A semiconductor package including: a base layer; a first chip stack and a second chip stack sequentially stacked over the base layer, each of the first and second chip stacks including a plurality of semiconductor chips which are offset stacked to expose chip pads at one side edge thereof, and the chip pads including stack identification pads for identifying the first chip stack and the second chip stack and chip identification pads for identifying the plurality of semiconductor chips in each of the first and second chip stacks; a first inter-chip wire and a second inter-chip wire connecting power-applied ones of the chip identification pads of the plurality of semiconductor chips of the first and second chip stacks; a first stack wire and second stack wire connecting the chip identification pad of a lowermost semiconductor chip of the first and second chip stacks to the base layer.