18648466. SEMICONDUCTOR PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Chen-Hsiang Lao of New Taipei City (TW)
Yuan-Sheng Chiu of Miaoli City (TW)
Hung-Chi Li of Taipei City (TW)
Shih-Chang Ku of Taipei City (TW)
Tsung-Shu Lin of New Taipei City (TW)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18648466 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of a first heat dissipation plate, a second heat dissipation plate, multiple heat generating assemblies, and various fixture components. The first heat dissipation plate has through holes from the upper surface to the lower surface, as does the second heat dissipation plate. The heat generating assemblies are positioned between the two plates, and fixture components like fix screws and nuts secure the plates together through the through holes.
- The semiconductor package includes two heat dissipation plates with through holes for efficient heat dissipation.
- Heat generating assemblies are placed between the plates to manage heat effectively.
- Fixture components like fix screws and nuts secure the plates together for stability.
Potential Applications: - This technology can be used in electronic devices to manage heat dissipation effectively. - It can be applied in computer systems, servers, and other high-performance electronic equipment.
Problems Solved: - Addresses the issue of heat buildup in electronic devices. - Provides a solution for managing heat efficiently in compact spaces.
Benefits: - Improved heat dissipation capabilities in electronic devices. - Enhanced performance and longevity of electronic components.
Commercial Applications: Title: Advanced Heat Dissipation Technology for Electronic Devices This technology can be utilized in the manufacturing of smartphones, laptops, and other consumer electronics to improve overall performance and reliability. It can also be integrated into industrial equipment and automotive systems to enhance efficiency and durability.
Prior Art: Further research can be conducted in the field of semiconductor packaging and heat dissipation technologies to explore existing solutions and advancements in the industry.
Frequently Updated Research: Researchers are continuously working on improving heat dissipation techniques in semiconductor packaging to meet the growing demands of high-performance electronic devices.
Questions about Semiconductor Package Heat Dissipation: 1. How does the placement of heat generating assemblies between the heat dissipation plates contribute to efficient heat management?
- The heat generating assemblies act as a bridge between the plates, allowing for effective heat transfer and dissipation.
2. What are the potential challenges in implementing this semiconductor package technology in various electronic devices?
- Some challenges may include compatibility issues with different device designs and the need for precise assembly processes to ensure optimal performance.
Original Abstract Submitted
A semiconductor package includes a first heat dissipation plate, a second heat dissipation plate, a plurality of heat generating assemblies, and a plurality of fixture components. The first heat dissipation plate has a first upper surface and a first lower surface. The first heat dissipation plate includes first through holes extended from the first upper surface to the first lower surface. The second heat dissipation plate has a second upper surface and a second lower surface. The second heat dissipation plate includes second through holes extended from the second upper surface to the second lower surface. The heat generating assemblies are disposed between the first heat dissipation plate and the second heat dissipation plate. The fixture components include fix screws and nuts. The fix screws penetrate through the first heat dissipation plate and the second heat dissipation plate along the first through holes and the second through holes.
