18647287. SEMICONDUCTOR DEVICE AND POWER CONVERTER simplified abstract (FUJI ELECTRIC CO., LTD.)
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SEMICONDUCTOR DEVICE AND POWER CONVERTER
Organization Name
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SEMICONDUCTOR DEVICE AND POWER CONVERTER - A simplified explanation of the abstract
This abstract first appeared for US patent application 18647287 titled 'SEMICONDUCTOR DEVICE AND POWER CONVERTER
The semiconductor device described in the patent application consists of a semiconductor package, a cooler for cooling the semiconductor package, a seal member with an opening between the semiconductor package and the cooler, and a thermally conductive member made of metal filling the opening.
- The semiconductor device includes a unique seal member with an opening that allows for the insertion of a thermally conductive metal member, enhancing heat dissipation.
- The metal filling the opening has fluidity, ensuring efficient thermal conductivity between the semiconductor package and the cooler.
- This innovation aims to improve the cooling efficiency of semiconductor devices, ultimately enhancing their performance and longevity.
- By utilizing a metal with fluidity in the seal member, heat transfer between the semiconductor package and the cooler is optimized.
- The design of this semiconductor device offers a practical solution for managing heat dissipation in electronic components.
Potential Applications: - This technology can be applied in various electronic devices such as computers, smartphones, and servers to improve their thermal management. - It can also be used in automotive electronics, industrial machinery, and aerospace systems where efficient heat dissipation is crucial.
Problems Solved: - Addresses the issue of heat buildup in semiconductor devices, which can lead to performance degradation and potential damage. - Provides a solution for enhancing the cooling efficiency of electronic components in various applications.
Benefits: - Improved thermal management leading to better performance and reliability of electronic devices. - Extended lifespan of semiconductor components due to optimized heat dissipation. - Enhanced overall efficiency and functionality of electronic systems.
Commercial Applications: - This technology can be valuable for semiconductor manufacturers, electronics companies, and industries requiring high-performance electronic systems. - It has the potential to drive innovation in the development of advanced cooling solutions for electronic devices, catering to a wide range of commercial applications.
Questions about Semiconductor Device Cooling Technology: 1. How does the use of a thermally conductive metal member in the seal member improve heat dissipation in semiconductor devices? 2. What are the potential long-term benefits of implementing this cooling technology in electronic systems?
Frequently Updated Research: Ongoing research in the field of semiconductor cooling technologies may provide further insights into optimizing heat dissipation in electronic devices. Stay updated on the latest advancements in this area for potential future applications and improvements.
Original Abstract Submitted
A semiconductor device comprising: a semiconductor package; a cooler for cooling the semiconductor package; a seal member provided between the semiconductor package and the cooler and having an opening penetrating therethrough between the semiconductor package and the cooler; and a thermally conductive member formed of a metal filling the opening, the metal having a fluidity.
