18647106. Heterogeneous Antenna in Fan-Out Package simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
Heterogeneous Antenna in Fan-Out Package
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Po-Hao Tsai of Taoyuan City (TW)
Heterogeneous Antenna in Fan-Out Package - A simplified explanation of the abstract
This abstract first appeared for US patent application 18647106 titled 'Heterogeneous Antenna in Fan-Out Package
The method described in the patent application involves bonding an antenna substrate to a redistribution structure, encapsulating the antenna substrate in an encapsulant, and bonding a package component to the redistribution structure.
- The antenna substrate contains a first part of a first antenna, while the redistribution structure contains a second part of the first antenna.
- The redistribution structure also includes a third part of a second antenna, and the package component includes a fourth part of the second antenna.
Potential Applications: - This technology could be used in the development of advanced wireless communication devices. - It may find applications in the manufacturing of compact and efficient antenna systems for IoT devices.
Problems Solved: - The method addresses the challenge of integrating multiple antenna components into a compact and reliable structure. - It streamlines the manufacturing process of antenna systems by simplifying the bonding and encapsulation steps.
Benefits: - Improved performance and reliability of antenna systems. - Cost-effective manufacturing process for complex antenna structures.
Commercial Applications: "Advanced Antenna Integration Method for Wireless Communication Devices"
Frequently Updated Research: Researchers are continuously exploring new materials and techniques to enhance the performance of integrated antenna systems.
Questions about the technology: 1. How does this method improve the efficiency of antenna systems? 2. What are the key challenges in integrating multiple antenna components into a compact structure?
Original Abstract Submitted
A method includes bonding an antenna substrate to a redistribution structure. The antenna substrate has a first part of a first antenna, and the redistribution structure has a second part of the first antenna. The method further includes encapsulating the antenna substrate in an encapsulant, and bonding a package component to the redistribution structure. The redistribution structure includes a third part of a second antenna, and the package component includes a fourth part of the second antenna.
