18644077. MANUFACTURING METHOD OF ELECTRONIC DEVICE simplified abstract (FUJIFILM Corporation)
Contents
MANUFACTURING METHOD OF ELECTRONIC DEVICE
Organization Name
Inventor(s)
Norihide Shimohara of Kanagawa (JP)
Kazuo Kamohara of Kanagawa (JP)
Kazuhiro Yokoi of Kanagawa (JP)
MANUFACTURING METHOD OF ELECTRONIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18644077 titled 'MANUFACTURING METHOD OF ELECTRONIC DEVICE
The manufacturing method of an electronic device involves preparing an electronic substrate with a wiring board, electronic component, and ground electrode.
- Forming an insulating layer on the electronic component is the first step.
- The second step involves forming an electromagnetic wave shielding layer on the insulating layer and ground electrode, which is electrically connected to the ground electrode.
- The insulating layer is created by applying an ink and irradiating it with active energy rays.
- The electromagnetic wave shielding layer is formed using an ink containing a metal compound, with a higher jetting temperature compared to the insulating layer ink.
Potential Applications: - This technology can be used in the manufacturing of various electronic devices such as smartphones, tablets, and computers. - It can also be applied in the aerospace industry for communication systems in aircraft.
Problems Solved: - Provides electromagnetic wave shielding to protect electronic components from interference. - Enhances the durability and performance of electronic devices.
Benefits: - Improved reliability and longevity of electronic devices. - Enhanced signal quality and reduced interference.
Commercial Applications: - This technology can be utilized by electronics manufacturers to produce high-quality and reliable products for consumers. - It can also be integrated into industrial equipment for improved performance and longevity.
Questions about the technology: 1. How does the electromagnetic wave shielding layer improve the performance of electronic devices? 2. What are the specific advantages of using a metal compound in the ink for the shielding layer?
Frequently Updated Research: - Stay updated on advancements in electromagnetic wave shielding technologies and materials to enhance the effectiveness of the shielding layer.
Original Abstract Submitted
Provided is a manufacturing method of an electronic device, including a step of preparing an electronic substrate including a wiring board, an electronic component, and a ground electrode, a first step of forming an insulating layer on the electronic component, and a second step of forming, on the insulating layer and on the ground electrode, an electromagnetic wave shielding layer that covers the insulating layer and is electrically connected to the ground electrode, to obtain an electronic device, in which, in the first step, the insulating layer is formed by applying an ink for an insulating layer and performing an irradiation with active energy ray on the applied ink for an insulating layer, in the second step, the electromagnetic wave shielding layer is formed by applying an ink for an electromagnetic wave shielding layer, containing a metal compound, and a jetting temperature of the ink for an insulating layer is higher than a jetting temperature of the ink for an electromagnetic wave shielding layer by 10° C. to 40° C.
