18641782. SEMICONDUCTOR PACKAGE (Samsung Electronics Co., Ltd.)
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 18641782 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
A semiconductor package may include a lower redistribution structure, conductive posts on an upper surface of the lower redistribution structure, a first semiconductor chip on the upper surface of the lower redistribution structure and separated from a conductive post in a first direction parallel to the upper surface of the lower redistribution structure, a radio frequency chip on the upper surface of the lower redistribution structure and separated from the first semiconductor chip in the first direction, a ground post between the first semiconductor chip and the radio frequency chip and configured to shield against an electromagnetic wave generated from the radio frequency chip, a molding layer covering the upper surface of the lower redistribution structure, and a ground layer in contact with an upper surface of the ground post. The molding layer may surround the conductive posts, first semiconductor chip, radio frequency chip, and ground post.
