18641449. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Chih-Hao Chen of Taipei City (TW)

Po-Yuan Cheng of Hsinchu (TW)

Pu Wang of Hsinchu City (TW)

Li-Hui Cheng of New Taipei City (TW)

Szu-Wei Lu of Hsinchu City (TW)

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 18641449 titled 'PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Simplified Explanation: The patent application describes a method for manufacturing a package structure for a semiconductor die, involving encapsulation with insulating material and coupling a heat dissipating component.

• **Key Features and Innovation:**

   - Formation of a package component with a semiconductor die encapsulated by insulating material with fillers.
   - De-bonding of a temporary carrier to expose the rear side of the semiconductor die.
   - Formation of a metallic layer on the rear side of the semiconductor die.
   - Coupling a heat dissipating component to the package component through the metallic layer.

• **Potential Applications:**

   - Semiconductor packaging industry.
   - Electronic devices requiring efficient heat dissipation.

• **Problems Solved:**

   - Enhancing thermal management in semiconductor packaging.
   - Improving the reliability and performance of electronic devices.

• **Benefits:**

   - Improved thermal conductivity.
   - Enhanced reliability of electronic components.
   - Better performance under high temperature conditions.

• **Commercial Applications:**

   - "Advanced Semiconductor Packaging Method for Enhanced Thermal Management and Reliability".
   - This technology can be applied in the manufacturing of various electronic devices, such as smartphones, laptops, and automotive electronics.

• **Questions about Semiconductor Packaging:**

   * **How does the metallic layer improve heat dissipation in the package structure?**
       - The metallic layer helps in efficiently transferring heat away from the semiconductor die to the heat dissipating component.
   * **What are the advantages of using fillers in the insulating encapsulation material?**
       - Fillers help improve the thermal conductivity and mechanical properties of the insulating material, enhancing the overall performance of the package structure.

Original Abstract Submitted

A manufacturing method of a package structure includes: forming a first package component over a temporary carrier, wherein the first package component comprises a semiconductor die encapsulated by an insulating encapsulation material that comprises a base layer and a plurality of fillers inside the base layer; de-bonding the temporary carrier to expose a rear side of the semiconductor die, wherein during the de-bonding, a portion of the fillers is accessibly revealed from the base layer to form an insulating encapsulation; forming a metallic layer on the rear side of the semiconductor die and the portion of the fillers of the insulating encapsulation; and coupling a heat dissipating component to the first package component at least through the metallic layer.