18639465. Power Distribution Network simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
Power Distribution Network
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Kam-Tou Sio of Zhubei City (TW)
Jiann-Tyng Tzeng of Hsinchu (TW)
Wei-Cheng Lin of Taichung City (TW)
Power Distribution Network - A simplified explanation of the abstract
This abstract first appeared for US patent application 18639465 titled 'Power Distribution Network
The abstract describes an integrated circuit with power rails, conductive lines, and active areas arranged in different layers to facilitate power distribution within the circuit.
- The integrated circuit includes a first pair of power rails and a second pair of power rails in a first layer.
- Conductive lines are located in a second layer above the power rails.
- A first active area is positioned in a third layer above the conductive lines, overlapping the first pair of power rails.
- The first active area is connected to the first pair of power rails through a first line and a first group of vias.
- The first active area is also connected to the second pair of power rails through at least one second line and a second group of vias.
Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and computers. - It can also be applied in automotive electronics, industrial control systems, and IoT devices.
Problems Solved: - Efficient power distribution within integrated circuits. - Reduction of signal interference. - Enhanced performance and reliability of electronic devices.
Benefits: - Improved power management. - Enhanced circuit efficiency. - Increased overall performance of electronic devices.
Commercial Applications: Title: "Advanced Integrated Circuit Technology for Enhanced Power Distribution" This technology can be utilized in the semiconductor industry for the development of high-performance integrated circuits used in a wide range of consumer electronics and industrial applications. The market implications include improved product performance, reliability, and efficiency.
Prior Art: Readers can explore prior art related to integrated circuit design, power distribution systems, and semiconductor technologies to gain a deeper understanding of the advancements made in this field.
Frequently Updated Research: Researchers are constantly exploring new methods to optimize power distribution in integrated circuits, improve signal integrity, and enhance overall circuit performance. Stay updated on the latest developments in semiconductor technology to leverage these advancements in future designs.
Questions about Integrated Circuit Technology: 1. What are the key challenges faced in optimizing power distribution within integrated circuits? - Answer: The main challenges include minimizing signal interference, ensuring efficient power delivery, and enhancing overall circuit performance.
2. How does the arrangement of power rails, conductive lines, and active areas impact the functionality of an integrated circuit? - Answer: The specific layout and connections between these components play a crucial role in determining the efficiency and performance of the integrated circuit.
Original Abstract Submitted
An integrated circuit includes a first pair of power rails and a second pair of power rails that are disposed in a first layer, conductive lines disposed in a second layer above the first layer, and a first active area disposed in a third layer above the second layer. The first active area is arranged to overlap the first pair of power rails. The first active area is coupled to the first pair of power rails through a first line of the conductive lines and a first group of vias, and the first active area is coupled to the second pair of power rails through at least one second line of the conductive lines and a second group of vias different from the first group of vias.
