18637539. BONDING STRUCTURES IN SEMICONDUCTOR PACKAGED DEVICE AND METHOD OF FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
BONDING STRUCTURES IN SEMICONDUCTOR PACKAGED DEVICE AND METHOD OF FORMING SAME
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Ching-Wen Hsiao of Hsinchu (TW)
Kuo-Ching Hsu of Chung-Ho City (TW)
Mirng-Ji Lii of Sinpu Township (TW)
BONDING STRUCTURES IN SEMICONDUCTOR PACKAGED DEVICE AND METHOD OF FORMING SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18637539 titled 'BONDING STRUCTURES IN SEMICONDUCTOR PACKAGED DEVICE AND METHOD OF FORMING SAME
Simplified Explanation:
This patent application describes a semiconductor device with multiple die regions, seal rings, and connectors. The connectors have an elongated shape with their long axis oriented towards the center of the die structure.
- The semiconductor device includes a die structure with multiple die regions and first seal rings surrounding each die region.
- A second seal ring surrounds the first seal rings.
- Connectors are bonded to the die structure, each having an elongated plan-view shape with the long axis oriented towards the center of the die structure.
Key Features and Innovation:
- Multiple die regions with corresponding first seal rings for protection.
- Second seal ring for additional sealing.
- Connectors with elongated shape for bonding to the die structure.
Potential Applications:
This technology could be used in various semiconductor devices requiring secure and reliable connections.
Problems Solved:
This technology addresses the need for secure bonding and sealing in semiconductor devices.
Benefits:
- Enhanced protection for die regions.
- Secure and reliable connections.
- Improved overall performance of semiconductor devices.
Commercial Applications:
Potential commercial applications include the manufacturing of advanced semiconductor devices for various industries such as electronics, telecommunications, and automotive.
Prior Art:
Readers can explore prior art related to semiconductor device packaging, seal rings, and connector technologies in the field of semiconductor engineering.
Frequently Updated Research:
Stay updated on the latest advancements in semiconductor device packaging, seal ring technologies, and connector innovations to enhance the performance and reliability of semiconductor devices.
Questions about Semiconductor Device with Seal Rings and Connectors:
1. What are the key components of a semiconductor device with seal rings and connectors? 2. How does the orientation of the connectors contribute to the overall functionality of the semiconductor device?
Original Abstract Submitted
A semiconductor device and a method of forming the same are provided. The semiconductor device includes a die structure including a plurality of die regions and a plurality of first seal rings. Each of the plurality of first seal rings surrounds a corresponding die region of the plurality of die regions. The semiconductor device further includes a second seal ring surrounding the plurality of first seal rings and a plurality of connectors bonded to the die structure. Each of the plurality of connectors has an elongated plan-view shape. A long axis of the elongated plan-view shape of each of the plurality of connectors is oriented toward a center of the die structure.
