18637061. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Atsushi Fujisaki of Suwon-si (KR)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18637061 titled 'SEMICONDUCTOR DEVICE
The semiconductor package described in the patent application includes a semiconductor chip, a redistribution layer structure, a bump pad, a metal seed layer, an insulating layer, and a bump structure.
- The bump pad has an upper structure of a first width and a lower structure of a second width less than the first width.
- The metal seed layer is disposed along a lower surface of the upper structure and a side surface of the lower structure.
- Undercuts are disposed at both ends of the metal seed layer, one contacting the upper structure and the other contacting the lower structure.
Potential Applications: - This technology can be used in the manufacturing of advanced semiconductor packages for various electronic devices. - It can improve the performance and reliability of semiconductor chips in applications such as smartphones, computers, and automotive electronics.
Problems Solved: - The technology addresses the need for more efficient and reliable semiconductor packaging solutions. - It helps in reducing signal interference and improving overall performance of electronic devices.
Benefits: - Enhanced performance and reliability of semiconductor chips. - Improved signal integrity and reduced electromagnetic interference. - Cost-effective manufacturing process for advanced semiconductor packages.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Performance This technology can be utilized in the production of high-performance electronic devices, leading to increased market competitiveness and customer satisfaction in industries such as consumer electronics, telecommunications, and automotive.
Questions about Semiconductor Packaging Technology: 1. How does the bump pad structure contribute to the overall performance of the semiconductor package? - The bump pad structure plays a crucial role in ensuring proper electrical connections and signal integrity within the semiconductor package.
2. What are the key advantages of using a metal seed layer in semiconductor packaging? - The metal seed layer helps in promoting adhesion between different layers of the package and enhancing the overall reliability of the semiconductor chip.
Original Abstract Submitted
A semiconductor package including a semiconductor chip, a redistribution layer structure disposed under the semiconductor chip, a bump pad disposed under the redistribution layer structure and having an upper structure of a first width and a lower structure of a second width less than the first width, a metal seed layer disposed along a lower surface of the upper structure and a side surface of the lower structure, an insulating layer surrounding the redistribution layer structure and the bump pad, and a bump structure disposed under the bump pad. A first undercut is disposed at one end of the metal seed layer that contacts the upper structure, and a second undercut is disposed at an other end of the metal seed layer that contacts the lower
