18636967. Modular Liquid Cooling Architecture for Liquid Cooling simplified abstract (Google LLC)
Contents
Modular Liquid Cooling Architecture for Liquid Cooling
Organization Name
Inventor(s)
Jerry Chiu of Pacifica CA (US)
Madhusudan K. Iyengar of Foster City CA (US)
Modular Liquid Cooling Architecture for Liquid Cooling - A simplified explanation of the abstract
This abstract first appeared for US patent application 18636967 titled 'Modular Liquid Cooling Architecture for Liquid Cooling
The abstract describes a housing and cooling system for computer hardware, consisting of an infrastructure module and a payload module. The infrastructure module houses computer hardware and is equipped with either a convective air cooling system or a liquid cooling system using metal plates connected by conduits. The infrastructure module also contains a programmable logic controller (PLC). The payload module, located outside the infrastructure module, includes an immersion cooling system governed by the PLC.
- The system includes an infrastructure module for housing computer hardware.
- The infrastructure module can be equipped with a convective air cooling system or a liquid cooling system using metal plates connected by conduits.
- A programmable logic controller (PLC) is housed within the infrastructure module.
- The payload module, located outside the infrastructure module, includes an immersion cooling system controlled by the PLC.
Potential Applications: - Data centers - High-performance computing facilities - Server rooms
Problems Solved: - Efficient cooling of computer hardware - Space-saving design - Programmable control for cooling systems
Benefits: - Improved cooling efficiency - Space optimization - Programmable control for customized cooling solutions
Commercial Applications: Title: "Advanced Cooling System for Computer Hardware" This technology can be used in data centers, server rooms, and high-performance computing facilities to enhance cooling efficiency and optimize space usage. The programmable logic controller allows for customized cooling solutions, making it a valuable asset in environments where temperature control is critical.
Questions about the technology: 1. How does the programmable logic controller enhance the cooling system's efficiency? The PLC allows for customized control of the cooling system, optimizing performance based on specific requirements. 2. What are the advantages of using an immersion cooling system in the payload module? Immersion cooling provides efficient heat dissipation and can be controlled by the PLC for precise temperature management.
Original Abstract Submitted
A housing and cooling system for computer hardware includes an infrastructure module and a payload module. The infrastructure module is configured for housing computer hardware and is equipped with either or both of a convective air cooling system and an arrangement of metal plates connected by one or more conduits for carrying liquid for cooling computer equipment housed by the infrastructure module. The infrastructure modules also houses a programmable logic controller (“PLC”). The payload module includes an immersion cooling system governed by the PLC and is located outside of the infrastructure module.
