18635315. CHIPLET INTERPOSER simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

CHIPLET INTERPOSER

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Shang-Yun Hou of Jubei (TW)

Weiming Chris Chen of Hsinchu (TW)

Kuo-Chiang Ting of Hsinchu (TW)

Hsien-Pin Hu of Zhubei (TW)

Wen-Chih Chiou of Zhunan Township (TW)

Chen-Hua Yu of Hsinchu (TW)

CHIPLET INTERPOSER - A simplified explanation of the abstract

This abstract first appeared for US patent application 18635315 titled 'CHIPLET INTERPOSER

The patent application describes packages and methods for forming packages with interposers made of dielectric material and redistribution structures with metallization patterns stitched together through a patterning process involving multiple lateral overlapping patterning exposures.

• Interposers with dielectric substrates
• Redistribution structures with metallization patterns
• Patterning process involving multiple lateral overlapping exposures
• Enhanced package formation techniques
• Improved interconnection reliability

Potential Applications: - Semiconductor packaging - Electronic device manufacturing - High-performance computing systems

Problems Solved: - Enhancing interconnection reliability - Improving package formation techniques - Increasing overall device performance

Benefits: - Enhanced reliability of interconnections - Improved performance of electronic devices - Increased efficiency in package formation processes

Commercial Applications: Title: Advanced Semiconductor Packaging Techniques This technology can be utilized in the semiconductor industry for manufacturing high-performance electronic devices, leading to improved reliability and efficiency in package formation processes. The market implications include increased demand for advanced packaging solutions in various electronic applications.

Questions about Advanced Semiconductor Packaging Techniques: 1. How does this technology improve interconnection reliability in electronic devices? This technology enhances interconnection reliability by utilizing dielectric substrates and metallization patterns in the redistribution structures, resulting in improved performance and durability of electronic devices.

2. What are the potential commercial applications of this innovation? The potential commercial applications of this innovation include semiconductor packaging, electronic device manufacturing, and high-performance computing systems, where the technology can be used to enhance device performance and reliability.

Original Abstract Submitted

Embodiments include packages and methods for forming packages which include interposers having a substrate made of a dielectric material. The interposers may also include a redistribution structure over the substrate which includes metallization patterns which are stitched together in a patterning process which includes multiple lateral overlapping patterning exposures.