18634198. Methods And Heat Distribution Devices For Thermal Management Of Chip Assemblies simplified abstract (GOOGLE LLC)

Methods And Heat Distribution Devices For Thermal Management Of Chip Assemblies

Organization Name

GOOGLE LLC

Inventor(s)

Madhusudan K. Iyengar of Foster City CA (US)

Christopher Malone of Mountain View CA (US)

Woon-Seong Kwon of Santa Clara CA (US)

Emad Samadiani of Cupertino CA (US)

Melanie Beauchemin of Mountain View CA (US)

Padam Jain of San Jose CA (US)

Teckgyu Kang of Saratoga CA (US)

Yuan Li of Sunnyvale CA (US)

Connor Burgess of Alameda CA (US)

Norman Paul Jouppi of Palo Alto CA (US)

Nicholas Stevens-yu of Palo Alto CA (US)

Yingying Wang of Sunnyvale CA (US)

Methods And Heat Distribution Devices For Thermal Management Of Chip Assemblies - A simplified explanation of the abstract

This abstract first appeared for US patent application 18634198 titled 'Methods And Heat Distribution Devices For Thermal Management Of Chip Assemblies

The method described in the patent application involves the manufacturing of a chip assembly by joining an in-process unit to a printed circuit board, reflowing a bonding material to electrically connect the unit with the board, and then attaching a heat distribution device to the semiconductor chips using a thermal interface material with a lower reflow temperature.

• Joining an in-process unit to a printed circuit board
• Reflowing a bonding material to electrically connect the unit with the board
• Attaching a heat distribution device to the semiconductor chips using a thermal interface material
• The thermal interface material has a lower reflow temperature than the bonding material
• The in-process unit includes a substrate, an interposer, semiconductor chips, and a stiffener with an aperture

Potential Applications: - Electronics manufacturing - Semiconductor industry - Thermal management systems

Problems Solved: - Efficient heat dissipation in chip assemblies - Improved electrical connections between components - Enhanced reliability of electronic devices

Benefits: - Better performance of electronic devices - Increased longevity of semiconductor chips - Enhanced thermal management capabilities

Commercial Applications: Title: Advanced Chip Assembly Technology for Improved Performance This technology can be utilized in the production of high-performance electronic devices such as smartphones, computers, and servers, where efficient heat dissipation and reliable electrical connections are crucial for optimal performance.

Questions about the technology: 1. How does the use of a thermal interface material with a lower reflow temperature benefit the manufacturing process? 2. What are the potential cost savings associated with implementing this chip assembly method?

Original Abstract Submitted

A method of manufacturing a chip assembly comprises joining an in-process unit to a printed circuit board; reflowing a bonding material disposed between and electrically connecting the in-process unit with the printed circuit board, the bonding material having a first reflow temperature; and then joining a heat distribution device to the plurality of semiconductor chips using a thermal interface material (“TIM”) having a second reflow temperature that is lower than the first reflow temperature. The in-process unit further comprises a substrate having an active surface, a passive surface, and contacts exposed at the active surface; an interposer electrically connected to the substrate; a plurality of semiconductor chips overlying the substrate and electrically connected to the substrate through the interposer, and a stiffener overlying the substrate and having an aperture extending therethrough, the plurality of semiconductor chips being positioned within the aperture.