18628434. THREE-DIMENSIONAL PRINTING simplified abstract (Hewlett-Packard Development Company, L.P.)
Contents
THREE-DIMENSIONAL PRINTING
Organization Name
Hewlett-Packard Development Company, L.P.
Inventor(s)
Jason C. Hower of Corvallis OR (US)
Mohammed S. Shaarawi of Corvallis OR (US)
Vladek P. Kasperchik of Corvallis OR (US)
James Mckinnell of Corvallis OR (US)
Jennifer L. Wu of Corvallis OR (US)
THREE-DIMENSIONAL PRINTING - A simplified explanation of the abstract
This abstract first appeared for US patent application 18628434 titled 'THREE-DIMENSIONAL PRINTING
In an example of a method for three-dimensional printing, a first amount of a binding agent is selectively applied, based on a 3D object model, to individual build material layers of a particulate build material including metal particles to forming an intermediate structure. The binding agent and/or a void-formation agent is selectively applied, based on the 3D object model, to at least one interior layer of the individual build material layers so that a total amount of the binding agent, the void-formation agent, or both the binding agent and the void-formation agent in the at least one of the individual build material layers is greater than the first amount. This patterns an area that is to contain voids. The intermediate structure is heated to form a 3D structure including a void-containing breakable connection.
- Selective application of binding agent based on 3D object model
- Formation of an intermediate structure with voids
- Heating process to create a 3D structure with breakable connections
Potential Applications: - Manufacturing of complex metal parts with internal voids - Prototyping in the aerospace industry for lightweight components - Custom jewelry design with intricate patterns and voids
Problems Solved: - Allows for the creation of complex metal structures with internal voids - Enables the production of lightweight parts with specific design requirements - Facilitates the customization of intricate designs in various industries
Benefits: - Enhanced design flexibility in 3D printing - Improved efficiency in manufacturing complex metal parts - Cost-effective production of customized components
Commercial Applications: Title: Advanced 3D Printing Technology for Metal Parts with Internal Voids This technology can be utilized in industries such as aerospace, automotive, and jewelry for the production of customized, lightweight parts with intricate designs and internal voids. The market implications include improved product performance, reduced production costs, and increased design possibilities.
Questions about 3D Printing Technology with Internal Voids: 1. How does the selective application of binding agents improve the manufacturing process? - The selective application of binding agents allows for precise control over the formation of voids within the 3D printed structure, enhancing design flexibility and customization options.
2. What are the potential challenges associated with heating the intermediate structure to form a 3D structure with breakable connections? - One potential challenge could be ensuring uniform heating throughout the structure to achieve consistent breakable connections without compromising the overall integrity of the part.
Original Abstract Submitted
In an example of a method for three-dimensional printing, a first amount of a binding agent is selectively applied, based on a 3D object model, to individual build material layers of a particulate build material including metal particles to forming an intermediate structure. The binding agent and/or a void-formation agent is selectively applied, based on the 3D object model, to at least one interior layer of the individual build material layers so that a total amount of the binding agent, the void-formation agent, or both the binding agent and the void-formation agent in the at least one of the individual build material layers is greater than the first amount. This patterns an area that is to contain voids. The intermediate structure is heated to form a 3D structure including a void-containing breakable connection.
