18626388. SEMICONDUCTOR PACKAGE DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE DEVICE
Organization Name
Inventor(s)
CHANGEUN Joo of Cheonan-si (KR)
SEMICONDUCTOR PACKAGE DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18626388 titled 'SEMICONDUCTOR PACKAGE DEVICE
The semiconductor package device described in the patent application includes a semiconductor chip with first and second chip pads on its active surface, as well as a redistribution substrate on these chip pads. The redistribution substrate consists of first and second redistribution patterns stacked on the active surface, with the first pattern including a first via part and a first via pad part, and the second pattern including a second via part and a second via pad part.
- The first via part contacts the first chip pad, while the second via part contacts the second chip pad.
- The length of the second via part is greater than that of the first via part.
Potential Applications: - This technology can be used in various semiconductor packaging applications where efficient redistribution of signals is required. - It can be applied in the manufacturing of advanced electronic devices such as smartphones, tablets, and computers.
Problems Solved: - Provides a more efficient way to redistribute signals on a semiconductor chip. - Enhances the overall performance and reliability of semiconductor package devices.
Benefits: - Improved signal distribution within the semiconductor package device. - Enhanced functionality and durability of electronic devices utilizing this technology.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Signal Distribution This technology can be utilized in the production of high-performance electronic devices, catering to industries such as consumer electronics, telecommunications, and computing.
Prior Art: Readers can explore prior patents related to semiconductor packaging technology, particularly focusing on innovations in signal redistribution and chip pad connectivity.
Frequently Updated Research: Stay updated on the latest advancements in semiconductor packaging technology, particularly in the field of signal redistribution and chip pad design.
Questions about Semiconductor Package Device: 1. How does this technology improve signal distribution within semiconductor package devices? 2. What are the potential commercial applications of this advanced semiconductor packaging technology?
Original Abstract Submitted
Disclosed is a semiconductor package device comprising a semiconductor chip including first and second chip pads on an active surface of the semiconductor chip, and a redistribution substrate on the first and second chip pads. The redistribution substrate includes first and second redistribution patterns sequentially stacked on the active surface. The first redistribution pattern includes a first via part and a first via pad part vertically overlapping the first via part. The second redistribution pattern includes a second via part and a second via pad part vertically overlapping the second via part. The first via part contacts the first chip pad. The second via part contacts the second chip pad. A length of the second via part is greater than that of the first via part.
