18626079. MICRO PATTERN MANUFACTURING METHOD USING PHOTOSENSITIVE RESIN COMPOUND simplified abstract (CANON KABUSHIKI KAISHA)
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MICRO PATTERN MANUFACTURING METHOD USING PHOTOSENSITIVE RESIN COMPOUND
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MICRO PATTERN MANUFACTURING METHOD USING PHOTOSENSITIVE RESIN COMPOUND - A simplified explanation of the abstract
This abstract first appeared for US patent application 18626079 titled 'MICRO PATTERN MANUFACTURING METHOD USING PHOTOSENSITIVE RESIN COMPOUND
The abstract describes a method for manufacturing micro patterns using a photosensitive resin compound containing an epoxy resin, a fluorine compound, a photocationic polymerization initiator, and a solvent with specific characteristics.
- The photosensitive resin layer is formed on a substrate using a photosensitive resin compound.
- The fluorine compound in the resin has a boiling or sublimation point of 200°C or higher.
- The solvent used contains an ester solvent, with a ratio of ester solvent to the entire solvent being equal to or larger than 5% by mass.
Potential Applications: - Microelectronics manufacturing - Microfluidics - Optics and photonics
Problems Solved: - Precise and reliable micro pattern manufacturing - Enhanced resolution and accuracy in microfabrication processes
Benefits: - Improved quality and consistency of micro patterns - Increased efficiency in manufacturing processes - Cost-effective production of intricate microstructures
Commercial Applications: Title: Advanced Micro Pattern Manufacturing Method for High-Tech Industries This technology can be used in industries such as semiconductor manufacturing, biomedical devices, and aerospace for producing intricate micro patterns with high precision and efficiency.
Questions about the technology: 1. How does the use of a fluorine compound in the photosensitive resin layer contribute to the manufacturing process? 2. What are the advantages of using an ester solvent in the solvent mixture for forming the photosensitive resin layer?
Original Abstract Submitted
A micro pattern manufacturing method includes a first process for forming a photosensitive resin layer on a substrate, and a second process for exposing and developing the photosensitive resin layer to form a micro pattern, wherein the photosensitive resin layer is formed by using a photosensitive resin compound containing an epoxy resin, a fluorine compound, a photocationic polymerization initiator, and a solvent, and wherein a boiling or sublimation point of the fluorine compound is 200° C. or higher, the solvent contains an ester solvent, and a ratio of the ester solvent to the entire solvent is equal to or larger than 5% by mass.
