18625662. WIRING SUBSTRATE simplified abstract (IBIDEN CO., LTD.)
Contents
WIRING SUBSTRATE
Organization Name
Inventor(s)
Masashi Kuwabara of Ibi-gun (JP)
Susumu Kagohashi of Ogaki (JP)
WIRING SUBSTRATE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18625662 titled 'WIRING SUBSTRATE
The abstract describes a wiring substrate with two build-up parts, each containing insulating and conductor layers, as well as via conductors. The first build-up part is stacked on the second build-up part, with different minimum wiring widths and inter-wiring distances between the conductor layers. The via conductors consist of two layers, with the first layer covering the inner wall surface of a via opening and having two distinct portions.
- The wiring substrate has two build-up parts with different wiring widths and inter-wiring distances.
- Via conductors consist of two layers, with the first layer having two distinct portions.
- The first build-up part is laminated on the second build-up part, creating a layered structure.
- The technology allows for more efficient and compact wiring configurations.
- The design enables higher density and performance in electronic devices.
Potential Applications: - Printed circuit boards - Semiconductor packaging - High-density interconnects
Problems Solved: - Improved wiring density - Enhanced performance in electronic devices
Benefits: - Increased efficiency in wiring configurations - Higher performance capabilities - Compact design for space-saving applications
Commercial Applications: Title: Advanced Wiring Substrate Technology for High-Density Electronics This technology can be utilized in various industries such as telecommunications, consumer electronics, and automotive for compact and high-performance electronic devices.
Questions about the technology: 1. How does the wiring substrate's design contribute to improved performance in electronic devices? 2. What are the key advantages of using this advanced wiring technology in semiconductor packaging?
Original Abstract Submitted
A wiring substrate includes a first build-up part including first insulating and conductor layers, and via conductors, and a second build-up part including second insulating and conductor layers. The first build-up part is laminated on the second build-up part. The minimum wiring width of wirings in the first conductor layers is smaller than the minimum wiring width of wirings in the second conductor layers. The minimum inter-wiring distance of the wirings in the first conductor layers is smaller than the minimum inter-wiring distance of the wirings in the second conductor layers. The first conductor layers and via conductors include a first layer and a second layer. The first layer of each via conductor is covering inner wall surface in a via opening and has a first portion and a second portion. The first portion has a portion formed closer to the center of the via opening than the second portion.
