18625541. ELECTRONIC COMPONENT AND EQUIPMENT simplified abstract (CANON KABUSHIKI KAISHA)
Contents
ELECTRONIC COMPONENT AND EQUIPMENT
Organization Name
Inventor(s)
SUSUMU Matsumoto of Kanagawa (JP)
SATORU Hamasaki of Kanagawa (JP)
TAIKI Shitamichi of Kanagawa (JP)
ELECTRONIC COMPONENT AND EQUIPMENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18625541 titled 'ELECTRONIC COMPONENT AND EQUIPMENT
Simplified Explanation: The patent application describes an electronic component with a base body, an electronic device on a placement surface, and a lid fixed to the base body. The lid has a thin film on its surface that applies force towards the outer edge of the film.
Key Features and Innovation:
- Electronic component with base body, electronic device, and lid
- Thin film on lid surface applying force towards outer edge
- Innovative design for securing electronic devices
Potential Applications: This technology could be used in various electronic devices such as smartphones, tablets, laptops, and other portable electronics.
Problems Solved: This technology addresses the issue of securely placing and protecting electronic devices within a component.
Benefits:
- Enhanced security for electronic devices
- Improved stability and protection
- Potential for increased durability of electronic components
Commercial Applications: Potential commercial applications include the manufacturing of electronic devices, consumer electronics, and industrial equipment.
Prior Art: Readers interested in prior art related to this technology could start by researching patents in the field of electronic components and device protection.
Frequently Updated Research: Researchers may find updated information on materials science, electronic component design, and device protection techniques relevant to this technology.
Questions about Electronic Component with Thin Film Technology: 1. How does the thin film on the lid surface enhance the security of the electronic device? 2. What are the potential implications of this technology for the consumer electronics market?
Original Abstract Submitted
An electronic component that includes a base body with an electronic device placed on a placement surface, and a lid including a surface facing the electronic device and fixed to the base body, is provided. On the surface of the lid, a thin film in contact with the surface is arranged. In an orthogonal projection with respect to the placement surface, the thin film comprises a first portion including a region which overlaps the electronic device, and a second portion arranged so as to surround the first portion and including an outer edge of the thin film, and the second portion applies, to a portion of the lid in contact with the second portion, a force in a direction from a center of the thin film toward the outer edge.
