18625419. BONDING METHOD AND BONDING SYSTEM simplified abstract (Tokyo Electron Limited)
Contents
- 1 BONDING METHOD AND BONDING SYSTEM
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 BONDING METHOD AND BONDING SYSTEM - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Questions about Bonding Method
- 1.11 Original Abstract Submitted
BONDING METHOD AND BONDING SYSTEM
Organization Name
Inventor(s)
Kazutaka Noda of Koshi City (JP)
Atsushi Nagata of Koshi City (JP)
Takashi Terada of Koshi City (JP)
BONDING METHOD AND BONDING SYSTEM - A simplified explanation of the abstract
This abstract first appeared for US patent application 18625419 titled 'BONDING METHOD AND BONDING SYSTEM
Simplified Explanation
The patent application describes a method for bonding substrates with exposed metal surfaces by modifying the surfaces with plasma, hydrophilizing them, and then bonding them together.
- Modifying substrate surfaces with plasma
- Hydrophilizing the modified surfaces
- Controlling the recess amount of metal material with a processing liquid during hydrophilization
- Bonding the hydrophilized surfaces of the substrates
Key Features and Innovation
- Surface modification with plasma for bonding
- Hydrophilization process to enhance bonding
- Control of metal material recess amount during hydrophilization
- Efficient and effective bonding method for substrates with metal surfaces
Potential Applications
The technology can be applied in various industries such as electronics, automotive, and aerospace for bonding metal substrates in manufacturing processes.
Problems Solved
- Ensures strong and reliable bonding of substrates with exposed metal surfaces
- Provides a controlled method for bonding metal materials
- Enhances the efficiency of bonding processes in industrial applications
Benefits
- Improved bonding strength and durability
- Enhanced control over the bonding process
- Increased efficiency and reliability in substrate bonding
Commercial Applications
- Industrial manufacturing processes requiring bonding of metal substrates
- Electronics industry for bonding metal components
- Automotive sector for structural bonding applications
Questions about Bonding Method
How does the plasma modification enhance the bonding process?
The plasma modification increases the surface energy of the substrates, promoting better adhesion during bonding.
What are the advantages of controlling the recess amount of metal material during hydrophilization?
Controlling the recess amount ensures uniform bonding and prevents excess metal material from interfering with the bonding process.
Original Abstract Submitted
A bonding method of bonding substrates, a metal material being exposed on each of the substrates, is provided. The bonding method includes modifying a surface of each of the substrates to be bonded with a plasma of a processing gas; hydrophilizing the modified surface of each of the substrates; and bonding the hydrophilized surfaces of the substrates. In the hydrophilizing of the modified surface, a processing liquid is supplied to the surface of each of the substrates, and a recess amount of the metal material is controlled with the processing liquid.
