18624903. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Shu-Shen Yeh of Taoyuan City (TW)
Chin-Hua Wang of New Taipei City (TW)
Po-Yao Lin of Zhudong Township (TW)
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18624903 titled 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
The patent application discusses semiconductor devices and methods that utilize lids to constrain thermal expansion during annealing processes.
- Lids are placed and attached on encapsulant or over first semiconductor dies to constrain expansion when heat is applied.
- The lids work to reduce the amount of stress that would otherwise accumulate within the encapsulant during expansion.
Potential Applications: - Semiconductor manufacturing - Electronics industry - Thermal management systems
Problems Solved: - Reducing stress in encapsulant during annealing - Improving overall device reliability - Enhancing thermal performance
Benefits: - Increased device longevity - Improved device performance - Enhanced reliability in harsh environments
Commercial Applications: Title: "Enhanced Semiconductor Device Manufacturing with Thermal Expansion Constraint" This technology can be applied in the production of various semiconductor devices, leading to more reliable and efficient products. The market implications include improved competitiveness and customer satisfaction in the electronics industry.
Questions about Semiconductor Device Manufacturing with Thermal Expansion Constraint: 1. How does the use of lids in semiconductor devices impact overall device performance? - The use of lids helps to reduce stress in the encapsulant, leading to improved device reliability and longevity. 2. What are the potential applications of this technology beyond semiconductor manufacturing? - This technology can also be applied in other industries where thermal management is crucial, such as automotive and aerospace.
Original Abstract Submitted
Semiconductor devices and methods of manufacture which utilize lids in order to constrain thermal expansion during annealing are presented. In some embodiments lids are placed and attached on encapsulant and, in some embodiments, over first semiconductor dies. As such, when heat is applied, and the encapsulant attempts to expand, the lid will work to constrain the expansion, reducing the amount of stress that would otherwise accumulate within the encapsulant.
