18624705. ELECTRONIC MODULE AND IMAGING APPARATUS simplified abstract (CANON KABUSHIKI KAISHA)
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ELECTRONIC MODULE AND IMAGING APPARATUS
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ELECTRONIC MODULE AND IMAGING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18624705 titled 'ELECTRONIC MODULE AND IMAGING APPARATUS
The abstract describes an electronic module with a unique frame member design that includes specific angles and distances between surfaces.
- The frame member of the electronic module has a first surface, a second surface, and an inner wall side surface.
- The inner wall side surface includes a first end face and a second end face with different angles formed by them.
- The distance between the second surface and a line passing through the first and second end faces is at least 10% of the distance between the first and second surfaces.
Potential Applications: - This design could be used in electronic devices where precise alignment and spacing are crucial. - It may find applications in industries requiring high-quality electronic components with specific dimensional requirements.
Problems Solved: - Addresses the need for improved structural integrity and alignment in electronic modules. - Provides a solution for maintaining consistent spacing and angles within the module.
Benefits: - Enhances the overall performance and reliability of electronic devices. - Allows for more efficient assembly processes due to the precise design specifications.
Commercial Applications: Title: Innovative Frame Member Design for Electronic Modules This technology could be utilized in the manufacturing of smartphones, tablets, laptops, and other electronic devices where compact and reliable components are essential. The market implications include improved product quality, reduced manufacturing defects, and enhanced customer satisfaction.
Questions about the Innovative Frame Member Design for Electronic Modules: 1. How does this frame member design improve the overall durability of electronic modules? 2. What specific industries could benefit the most from implementing this innovative design in their electronic devices?
Frequently Updated Research: Stay updated on the latest advancements in electronic module design and manufacturing processes to ensure optimal performance and reliability in electronic devices.
Original Abstract Submitted
An electronic module includes a first substrate and a frame member. The frame member includes a first surface and a second surface, and an inner wall side surface in contact with the first and second surfaces. The inner wall side surface includes at least a first end face and a second end face. A normal line to the second surface is a first line, and a line parallel to the second surface, passing through a point where the first end face contacts the second end face, is a second line. An angle formed by the first line and the first end face is different from an angle formed by the first line and the second end face. A distance between the second surface and the second line with respect to the second surface is larger than or equal to 10% of a distance between the first and second surfaces.
