18624360. SINTER BONDING SHEET simplified abstract (NITTO DENKO CORPORATION)
Contents
SINTER BONDING SHEET
Organization Name
Inventor(s)
Ryota Mita of Ibaraki-shi (JP)
Yuichi Okoba of Ibaraki-shi (JP)
SINTER BONDING SHEET - A simplified explanation of the abstract
This abstract first appeared for US patent application 18624360 titled 'SINTER BONDING SHEET
The abstract describes a sinter bonding sheet with a sinter bonding layer containing conductive metal particles and an organic binder. The layer has two adhesive surfaces for bonding to different adherends, with specific load requirements during nanoindentation measurements.
- The sinter bonding sheet includes a sinter bonding layer with conductive metal particles and an organic binder.
- The layer has two adhesive surfaces for bonding to different adherends.
- Specific load requirements must be met during nanoindentation measurements on the adhesive surfaces.
Potential Applications: - Electronics manufacturing - Automotive industry for bonding components - Aerospace industry for structural bonding
Problems Solved: - Improved bonding strength between different materials - Enhanced conductivity in bonded components
Benefits: - Strong and reliable bonding - Increased electrical conductivity - Versatile applications in various industries
Commercial Applications: Title: Advanced Sinter Bonding Sheet for Enhanced Adhesion in Electronics Manufacturing This technology can be used in the production of electronic devices, automotive components, and aerospace structures, offering superior bonding strength and conductivity.
Questions about Sinter Bonding Sheets: 1. How does the composition of the sinter bonding layer contribute to its adhesive properties? The sinter bonding layer's composition, including conductive metal particles and an organic binder, plays a crucial role in enhancing adhesion between different materials.
2. What are the specific load requirements during nanoindentation measurements, and how do they impact the bonding strength of the sinter bonding sheet? The specific load requirements during nanoindentation measurements ensure that the sinter bonding sheet meets the necessary standards for bonding strength, providing reliable adhesion in various applications.
Original Abstract Submitted
A sinter bonding sheet includes a sinter bonding layer that includes sinterable particles containing a conductive metal, and an organic binder, in which the sinter bonding layer has a first adhesive surface for being adhered to an adherend and a second adhesive surface for being adhered to another adherend, and when the value of the minimum load reached during an unloading step in a load-displacement measurement according to the nanoindentation method to the first adhesive surface is b1, and the value of the minimum load reached during the unloading step in the load-displacement measurement according to the nanoindentation method to the second adhesive surface is b2, b1 satisfies −100 μN≤b1≤−35 μN and b2 satisfies −100 μN≤b2≤−35 μN.
