18624279. BONDING APPARATUS AND BONDING METHOD simplified abstract (Tokyo Electron Limited)
Contents
BONDING APPARATUS AND BONDING METHOD
Organization Name
Inventor(s)
Tetsuya Maki of Koshi City (JP)
BONDING APPARATUS AND BONDING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18624279 titled 'BONDING APPARATUS AND BONDING METHOD
The bonding apparatus described in the abstract consists of a first holder that attracts and holds a first substrate from above, a second holder that attracts and holds a second substrate from below, a moving mechanism that allows the holders to approach each other, a rough adjustment device for positioning the first substrate before it is held, and a fine adjustment device with a driver to finely adjust the position of the first substrate.
- The bonding apparatus has a unique design with two holders attracting substrates from different directions.
- The moving mechanism enables precise alignment of the substrates for bonding.
- The rough adjustment device helps in setting the initial position of the substrate accurately.
- The fine adjustment device utilizes a piezoelectric element for precise rotational adjustments.
- Overall, the apparatus offers a comprehensive solution for bonding substrates with high precision.
Potential Applications: - Semiconductor manufacturing - Microelectronics assembly - Optoelectronics production
Problems Solved: - Ensures accurate alignment of substrates - Facilitates precise bonding process - Improves overall efficiency in substrate bonding operations
Benefits: - Enhanced precision in substrate bonding - Increased productivity in manufacturing processes - Reduction in material wastage
Commercial Applications: Title: Advanced Bonding Apparatus for Semiconductor Manufacturing This technology can be utilized in industries such as semiconductor manufacturing, microelectronics assembly, and optoelectronics production. It offers a high level of precision in substrate bonding, leading to improved efficiency and productivity in manufacturing processes.
Questions about Bonding Apparatus: 1. How does the moving mechanism in the bonding apparatus work to align the substrates accurately? The moving mechanism in the bonding apparatus allows one holder to approach the other, enabling precise alignment of the substrates before bonding.
2. What is the role of the fine adjustment device in the bonding process? The fine adjustment device, with a driver that displaces a piezoelectric element, helps in finely adjusting the position of the substrate for precise bonding.
Original Abstract Submitted
A bonding apparatus includes a first holder configured to attract and hold a first substrate from above; a second holder located lower than the first holder and configured to attract and hold a second substrate from below; a moving mechanism configured to allow a first one of the first holder and the second holder to approach a second one of the first holder and the second holder; a rough adjustment device configured to roughly adjust a position in a rotational direction of the first substrate before the first substrate is attracted and held by the first holder; a fine adjustment device, including at least one first driver configured to rotate the first holder by displacing a piezoelectric element, configured to finely adjust, with the at least one first driver, the position in the rotational direction of the first substrate attracted and held by the first holder.
