18623992. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Chen-Hua Yu of Hsinchu City (TW)
Kuo-Chung Yee of Taoyuan City (TW)
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18623992 titled 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
The semiconductor device described in the patent application consists of a first die with a patterned conductive pad, a second die stacked over and electrically coupled to the first die, a bonding dielectric layer between the two dies, and a through die via that penetrates through the first die, the patterned conductive pad, and the bonding dielectric layer. The second die includes a conductive pad directly over the patterned conductive pad, with the bonding dielectric layer bonding the two pads together, and the through die via landing directly on the conductive pad.
- The first die in the semiconductor device has a patterned conductive pad.
- The second die is stacked over the first die and has a conductive pad directly over the patterned conductive pad.
- A bonding dielectric layer is present between the first and second dies.
- A through die via penetrates through the first die, the patterned conductive pad, and the bonding dielectric layer.
- The through die via directly lands on the conductive pad of the second die.
Potential Applications: - This technology can be used in the manufacturing of advanced semiconductor devices. - It can improve the electrical coupling between stacked dies in electronic devices.
Problems Solved: - Enhances the electrical connection between stacked dies. - Provides a reliable and efficient bonding method for semiconductor devices.
Benefits: - Improved performance and reliability of semiconductor devices. - Enhanced electrical connectivity between stacked dies.
Commercial Applications: Title: Advanced Semiconductor Device Bonding Technology This technology can be applied in the production of high-performance electronic devices such as smartphones, tablets, and computers. It can also be utilized in the automotive industry for advanced driver assistance systems and in the aerospace sector for avionics.
Prior Art: Readers can explore prior research on semiconductor device bonding techniques, die stacking methods, and through die via technologies to gain a deeper understanding of the advancements presented in this patent application.
Frequently Updated Research: Researchers are continuously exploring new materials and processes to further improve the efficiency and reliability of semiconductor device bonding technologies. Stay updated on the latest developments in this field to leverage cutting-edge advancements in electronic manufacturing.
Questions about Semiconductor Device Bonding Technology: 1. How does the through die via technology improve the electrical coupling between stacked dies? 2. What are the potential challenges in implementing this advanced semiconductor bonding technology in mass production?
Original Abstract Submitted
A semiconductor device includes a first die including a patterned conductive pad, a second die stacked over and electrically coupled to the first die, a bonding dielectric layer between the first and second dies, and a through die via penetrating through the first die and passing through the patterned conductive pad and the bonding dielectric layer. The second die includes a conductive pad directly over the patterned conductive pad. The bonding dielectric layer bonds the patterned conductive pad to the conductive pad, and the through die via directly lands on the conductive pad.
