18622511. LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING simplified abstract (Intel Corporation)

LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING

Organization Name

Intel Corporation

Inventor(s)

Kristof Darmawikarta of Chandler AZ (US)

Hiroki Tanaka of GILBERT AZ (US)

Robert May of Chandler AZ (US)

Sameer Paital of Chandler AZ (US)

Bai Nie of Chandler AZ (US)

Jesse Jones of Chandler AZ (US)

Chung Kwang Christopher Tan of Chandler AZ (US)

LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING - A simplified explanation of the abstract

This abstract first appeared for US patent application 18622511 titled 'LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING

The abstract describes an electronic package with an Embedded Multi-Interconnect Bridge (EMIB) and methods for creating such packages. It involves layers of organic material, a cavity exposing a surface, a bridge substrate in the cavity, and multiple dies electrically coupled to the bridge substrate.

• The electronic package includes an EMIB for enhanced interconnectivity.
• The package consists of organic material layers with a cavity exposing a surface for support.
• A bridge substrate is placed in the cavity to facilitate electrical connections.
• Multiple dies are electrically coupled to the bridge substrate for integrated functionality.
• The technology enables efficient communication between different components in the package.

Potential Applications: - High-performance computing systems - Advanced telecommunications devices - Aerospace and defense electronics - Automotive electronics - Medical devices and equipment

Problems Solved: - Improved interconnectivity in electronic packages - Enhanced reliability and performance of integrated circuits - Space-saving design for compact electronic devices

Benefits: - Increased efficiency in data transmission - Enhanced reliability and durability of electronic components - Compact and lightweight design for portable devices - Cost-effective manufacturing process

Commercial Applications: Title: Enhanced Electronic Packaging Technology for High-Performance Devices This technology can be utilized in various industries such as telecommunications, aerospace, automotive, and medical sectors for developing advanced electronic devices with improved performance and reliability.

Questions about the technology: 1. How does the Embedded Multi-Interconnect Bridge (EMIB) enhance the functionality of electronic packages? - The EMIB facilitates efficient communication between different components in the package, improving overall performance and reliability.

2. What are the key advantages of using organic material layers in electronic packaging? - Organic material layers provide a lightweight and cost-effective solution for creating compact electronic devices with enhanced functionality.

Original Abstract Submitted

Embodiments include an electronic package with an embedded multi-interconnect bridge (EMIB) and methods of making such packages. Embodiments include a first layer, that is an organic material and a second layer disposed over the first layer. In an embodiment, a cavity is formed through the second layer to expose a first surface of the first layer. A bridge substrate is in the cavity and is supported by the first surface of the first layer. Embodiments include a first die over the second layer that is electrically coupled to a first contact on the bridge substrate, and a second die over the second layer that is electrically coupled to a second contact on the bridge substrate. In an embodiment the first die is electrically coupled to the second die by the bridge substrate.