18621138. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

PACKAGE STRUCTURE

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Wen-Shiang Liao of Miaoli County (TW)

PACKAGE STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18621138 titled 'PACKAGE STRUCTURE

The abstract describes a package structure that includes two radio frequency dies with different frequency ranges, an insulating encapsulant, a redistribution circuit structure, and two oscillation cavities.

• The first radio frequency die and the second radio frequency die have different frequency ranges.
• The insulating encapsulant surrounds and protects the radio frequency dies.
• The redistribution circuit structure is located on the radio frequency dies and the encapsulant.
• The first and second oscillation cavities are electrically connected to the respective radio frequency dies.

Potential Applications: - This technology could be used in wireless communication devices. - It may find applications in radar systems. - It could be utilized in satellite communication systems.

Problems Solved: - Provides a compact and efficient package structure for radio frequency components. - Ensures proper isolation and protection of the radio frequency dies. - Facilitates the integration of different frequency range components in a single package.

Benefits: - Improved performance of radio frequency components. - Enhanced reliability and durability of the package structure. - Simplified design and assembly process for electronic devices.

Commercial Applications: Title: Advanced Radio Frequency Package Structure for Enhanced Communication Systems This technology could be valuable for telecommunications companies, defense contractors, and electronics manufacturers looking to enhance the performance of their communication systems.

Prior Art: Further research can be conducted in the field of radio frequency package structures, encapsulation techniques, and integration of components with different frequency ranges.

Frequently Updated Research: Researchers are constantly exploring new materials and techniques for improving the efficiency and performance of radio frequency components. Stay updated on the latest advancements in the field to leverage the full potential of this technology.

Questions about Radio Frequency Package Structure: 1. How does the insulating encapsulant contribute to the protection of the radio frequency dies?

  - The insulating encapsulant surrounds and protects the radio frequency dies, ensuring their isolation and preventing interference.

2. What are the potential challenges in integrating radio frequency components with different frequency ranges in a single package?

  - Integrating components with different frequency ranges may require careful design considerations to avoid interference and ensure optimal performance.

Original Abstract Submitted

A package structure including a first radio frequency die, a second radio frequency die, an insulating encapsulant, a redistribution circuit structure, a first oscillation cavity and a second oscillation cavity is provided. A first frequency range of the first radio frequency die is different from a second frequency range of the second radio frequency die. The insulating encapsulant laterally encapsulates the first radio frequency die and the second radio frequency die. The redistribution circuit structure is disposed on the first radio frequency die, the second die and the insulating encapsulant. The first oscillation cavity is electrically connected to the first radio frequency die, and the second oscillation cavity is electrically connected to the second radio frequency die.