18619037. HETEROGENEOUS PACKAGING INTEGRATION OF PHOTONIC AND ELECTRONIC ELEMENTS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
HETEROGENEOUS PACKAGING INTEGRATION OF PHOTONIC AND ELECTRONIC ELEMENTS
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Wei-wei Song of Sunnyvale CA (US)
Mohammed Rabiul Islam of Austin TX (US)
HETEROGENEOUS PACKAGING INTEGRATION OF PHOTONIC AND ELECTRONIC ELEMENTS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18619037 titled 'HETEROGENEOUS PACKAGING INTEGRATION OF PHOTONIC AND ELECTRONIC ELEMENTS
Simplified Explanation: The patent application describes a package that integrates both electronic and photonic elements in a heterogeneous manner.
Key Features and Innovation:
- Package includes a substrate, an electronic die, and a photonic die.
- Photonic die is bonded onto the electronic die, enabling integration of both types of elements.
- Heterogeneous packaging design allows for efficient coexistence of electronic and photonic components.
Potential Applications: This technology could be used in telecommunications, data centers, and other industries requiring integrated electronic and photonic systems.
Problems Solved:
- Enables seamless integration of electronic and photonic elements in a single package.
- Improves efficiency and performance of systems requiring both types of components.
Benefits:
- Enhanced functionality and performance of electronic and photonic systems.
- Simplified packaging design for heterogeneous integration of components.
Commercial Applications: Potential commercial applications include telecommunications equipment, high-speed data processing systems, and advanced computing devices.
Prior Art: Readers can explore prior art related to heterogeneous packaging integration in the fields of photonics, electronics, and semiconductor packaging.
Frequently Updated Research: Stay informed about the latest advancements in heterogeneous packaging integration by following research publications in photonics, electronics, and packaging technologies.
Questions about Heterogeneous Packaging Integration: 1. How does heterogeneous packaging integration benefit electronic and photonic systems?
- Heterogeneous packaging integration improves system performance and efficiency by enabling the seamless coexistence of electronic and photonic elements.
2. What are the potential challenges in implementing heterogeneous packaging integration?
- Challenges may include ensuring proper alignment and bonding of electronic and photonic dies, as well as managing thermal dissipation in integrated systems.
Original Abstract Submitted
Heterogeneous packaging integration of photonic and electronic elements is described herein. In one embodiment, a disclosed package includes: a package substrate; a first layer comprising an electronic die on the package substrate; and a second layer comprising a photonic die. The second layer is bonded onto the first layer such that the photonic die is bonded onto the electronic die.
