18617422. SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Wang-Chun Huang of Kaohsiung City (TW)
Hou-Yu Chen of Hsinchu County (TW)
Kuan-Lun Cheng of Hsinchu City (TW)
Chih-Hao Wang of Hsinchu County (TW)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18617422 titled 'SEMICONDUCTOR DEVICE
The abstract of the patent application describes a device with a unique backside via structure connected to the source/drain structures.
- The device includes a channel layer, gate structure, first source/drain structure, second source/drain structure, and backside via.
- The gate structure surrounds the channel layer, while the source/drain structures are connected to it.
- The backside via is connected to the backside of the first source/drain structure and consists of three portions.
- The third portion of the backside via tapers from the second portion to the first portion, with a more inclined sidewall.
Potential Applications: - This technology could be used in semiconductor devices for improved performance and efficiency. - It may find applications in the manufacturing of advanced electronic components.
Problems Solved: - Enhances the connectivity and functionality of semiconductor devices. - Improves the overall performance and reliability of electronic systems.
Benefits: - Increased efficiency and performance of electronic devices. - Enhanced connectivity and functionality of semiconductor components.
Commercial Applications: Title: Advanced Semiconductor Device Technology for Enhanced Performance This technology could be utilized in the production of high-performance electronic devices, leading to improved consumer electronics, telecommunications equipment, and industrial machinery.
Questions about the technology: 1. How does the backside via structure improve the performance of the device?
The backside via structure enhances connectivity and functionality by providing a unique connection to the source/drain structures.
2. What are the potential implications of this technology in the semiconductor industry?
This technology could lead to the development of more efficient and reliable electronic components, benefiting various sectors such as consumer electronics and telecommunications.
Original Abstract Submitted
A device includes a channel layer, a gate structure, a first source/drain structure, a second source/drain structure, and a backside via. The gate structure surrounds the channel layer. The first source/drain structure and the second source/drain structure ate connected to the channel layer. The backside via is connected to a backside of the first source/drain structure. The backside via includes a first portion, a second portion, and a third portion. The first portion is connected to the backside of the first source/drain structure. The third portion tapers from the second portion to the first portion. A sidewall of the third portion is more inclined than a sidewall of the second portion.
