18617113. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Seokgeun Ahn of Cheonan-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18617113 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation:
The semiconductor package described in the patent application includes a package substrate with a concave portion, through-holes, and semiconductor chips mounted on the substrate. A molding portion covers the chips and fills the through-holes.
- The semiconductor package has a unique design with a concave portion and oblique through-holes.
- Multiple semiconductor chips are mounted on the package substrate.
- A molding portion covers the chips and fills the through-holes for protection and stability.
Key Features and Innovation:
- Package substrate with a concave portion and oblique through-holes.
- Plurality of semiconductor chips mounted on the substrate.
- Molding portion for covering and protecting the semiconductor chips.
Potential Applications:
This technology can be used in various electronic devices such as smartphones, tablets, and computers.
Problems Solved:
This technology addresses the need for a compact and efficient packaging solution for semiconductor chips.
Benefits:
- Improved protection and stability for semiconductor chips.
- Space-saving design with the concave portion and oblique through-holes.
Commercial Applications:
Potential commercial applications include consumer electronics, automotive electronics, and industrial equipment.
Questions about Semiconductor Package Technology: 1. How does the concave portion of the package substrate contribute to the overall design? 2. What are the advantages of using oblique through-holes in the semiconductor package design?
Frequently Updated Research:
There may be ongoing research in the field of semiconductor packaging technology to further enhance the performance and efficiency of these packages.
Original Abstract Submitted
A semiconductor package is provided. The semiconductor package includes: a package substrate having a first surface, a second surface that is provided opposite the first surface and has a concave portion, and a through-hole having a side surface that is oblique with respect to the first surface, and a first diameter of a first opening of the through-hole defined through the first surface being less than a second diameter of a second opening of the through-hole defined through a bottom surface of the concave portion; a plurality of first semiconductor chips provided on the first surface; a second semiconductor chip provided on the bottom surface; and a molding portion provided in the through-hole, and covering the plurality of first semiconductor chips and the second semiconductor chip.
