18616427. Fan-Out Package Having a Main Die and a Dummy Die simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
Fan-Out Package Having a Main Die and a Dummy Die
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Yan-Fu Lin of Zhubei City (TW)
Hsien-Wei Chen of Hsinchu (TW)
Fan-Out Package Having a Main Die and a Dummy Die - A simplified explanation of the abstract
This abstract first appeared for US patent application 18616427 titled 'Fan-Out Package Having a Main Die and a Dummy Die
Simplified Explanation: The patent application describes a fan-out package with a main die and a dummy die placed side-by-side, covered with molding material and a redistribution layer containing vias and conductive lines.
Key Features and Innovation:
- Fan-out package design with main die and dummy die.
- Molding material along sidewalls of the dies.
- Redistribution layer with vias and conductive lines.
- Electrical connection to connectors of the main die.
Potential Applications: This technology can be used in semiconductor packaging for various electronic devices such as smartphones, tablets, and computers.
Problems Solved: The technology addresses the need for efficient and reliable electrical connections in compact electronic devices.
Benefits:
- Improved electrical connectivity.
- Enhanced performance of electronic devices.
- Compact design for space-saving.
Commercial Applications: The technology can be applied in the manufacturing of consumer electronics, automotive electronics, and IoT devices, enhancing their performance and reliability.
Prior Art: Readers can explore prior art related to fan-out packages, semiconductor packaging, and redistribution layers in the field of electronic packaging technologies.
Frequently Updated Research: Stay updated on the latest advancements in fan-out packaging technologies, semiconductor packaging materials, and electrical connectivity solutions.
Questions about Fan-Out Packages: 1. What are the key components of a fan-out package and how do they contribute to its functionality? 2. How does the use of vias and conductive lines in the redistribution layer improve the performance of the fan-out package?
Original Abstract Submitted
A fan-out package having a main die and a dummy die side-by-side is provided. A molding material is formed along sidewalls of the main die and the dummy die, and a redistribution layer having a plurality of vias and conductive lines is positioned over the main die and the dummy die, where the plurality of vias and the conductive lines are electrically connected to connectors of the main die.
