18615681. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE simplified abstract (SK Hynix Inc.)
Contents
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Sang Yong Lee of Icheon-si (KR)
Sae Jun Kwon of Icheon-si (KR)
Sang Min Kim of Icheon-si (KR)
Jin Taek Park of Icheon-si (KR)
Sang Hyun Oh of Icheon-si (KR)
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18615681 titled 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract includes a line, a source structure, a stack structure, two slit structures, and a contact plug.
- The first and second slit structures penetrate the stack structure and are spaced apart from each other in different directions.
- The contact plug is adjacent to the first slit structure and is electrically connected to the lower line.
- The contact plug penetrates the source structure, providing electrical connection to the lower line.
- The first slit structure and the contact plug are spaced apart from each other in a specific direction.
Potential Applications: This technology could be used in the manufacturing of advanced semiconductor devices for various electronic applications.
Problems Solved: This innovation addresses the need for efficient electrical connections in semiconductor devices.
Benefits: The technology offers improved performance and reliability in semiconductor devices.
Commercial Applications: This technology could be valuable in the production of high-performance electronic devices for consumer electronics, telecommunications, and automotive industries.
Questions about the technology: 1. How does this semiconductor device improve overall device performance?
- This technology enhances device performance by providing efficient electrical connections.
2. What are the potential cost savings associated with implementing this innovation?
- The technology could lead to cost savings in manufacturing processes and improved device reliability.
Original Abstract Submitted
A semiconductor device includes a line; a source structure on the line; a stack structure on the source structure; a first slit structure penetrating the stack structure; a second slit structure penetrating the stack structure; and a contact plug adjacent to the first slit structure in a first direction. The first slit structure and the second slit structure may be spaced apart from each other by a first distance in a second direction that is perpendicular to the first direction. The contact plug penetrates the source structure, the contact plug being electrically connected to the lower line. The first slit structure and the contact plug may be spaced apart from each other by a second distance in the first direction, and the second distance may be longer than the first distance.
