18614756. METHOD OF FORMING PACKAGE STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
Contents
METHOD OF FORMING PACKAGE STRUCTURE
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Shu-Hang Liao of Hsinchu City (TW)
Chih-Wei Wu of Yilan County (TW)
Jing-Cheng Lin of Hsinchu City (TW)
Szu-Wei Lu of Hsinchu City (TW)
Ying-Ching Shih of Hsinchu City (TW)
METHOD OF FORMING PACKAGE STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18614756 titled 'METHOD OF FORMING PACKAGE STRUCTURE
The abstract describes a method of forming a package structure, involving the formation of a dielectric layer on two dies, the placement of a bridge to connect the dies, the encapsulation of the bridge with an encapsulant, and the formation of a redistribution layer structure over the bridge.
- Dielectric layer formed on first and second dies
- Bridge placed to electrically connect the dies
- Encapsulant formed to encapsulate the bridge
- Redistribution layer structure formed over the bridge
- Top surface of the bridge in contact with the redistribution layer structure
Potential Applications: - Semiconductor packaging - Integrated circuit manufacturing
Problems Solved: - Improved electrical connections between dies - Enhanced structural integrity of package
Benefits: - Increased reliability of electronic devices - Enhanced performance of integrated circuits
Commercial Applications: Title: Advanced Semiconductor Packaging Technology This technology can be used in the production of high-performance electronic devices, such as smartphones, computers, and automotive electronics. It can also benefit the aerospace and defense industries by improving the reliability and performance of electronic components in harsh environments.
Questions about the technology: 1. How does this method improve the electrical connections between dies? 2. What are the advantages of encapsulating the bridge in the package structure?
Original Abstract Submitted
A method of forming package structure is provided. The method includes the following steps. A dielectric layer is formed on the first die and the second die. A bridge is placed to electrically connected to the first die and the second die, wherein the dielectric layer is spaced apart from the bridge. An encapsulant is formed on the dielectric layer and laterally encapsulating the bridge. A redistribution layer structure is formed over the encapsulant and the bridge. A top surface of the bridge is in contact with the RDL structure.
