18612949. SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIGATE HOT SPOTS simplified abstract (Intel Corporation)

SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIGATE HOT SPOTS

Organization Name

Intel Corporation

Inventor(s)

Shrenik Kothari of Phoenix AZ (US)

Chandra Mohan Jha of Tempe AZ (US)

Weihua Tang of Chandler AZ (US)

Robert Sankman of Phoenix AZ (US)

Xavier Brun of Chandler AZ (US)

Pooya Tadayon of Portland OR (US)

SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIGATE HOT SPOTS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18612949 titled 'SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIGATE HOT SPOTS

Simplified Explanation: This patent application describes semiconductor dies with specific layers and a heat spreader attached.

Key Features and Innovation:

• Semiconductor die with a semiconductor substrate, active device layer, interconnect layer, bonding layers, and a heat spreader attached.
• Active device layer includes one or more transistors.
• Heat spreader improves thermal management of the semiconductor die.

Potential Applications: This technology can be used in various electronic devices such as computers, smartphones, and other semiconductor-based products.

Problems Solved: This technology addresses the issue of thermal management in semiconductor devices, ensuring efficient operation and longevity.

Benefits:

• Improved thermal performance
• Enhanced reliability and longevity of semiconductor devices
• Better overall performance of electronic products

Commercial Applications: Potential commercial applications include the manufacturing of high-performance electronic devices, data centers, and telecommunications equipment.

Prior Art: Readers can explore prior art related to semiconductor die technology in the field of semiconductor manufacturing processes and materials.

Frequently Updated Research: Stay updated on the latest research in semiconductor die technology, materials science, and thermal management techniques for electronic devices.

Questions about Semiconductor Dies: 1. What are the key components of a semiconductor die? 2. How does the heat spreader improve the performance of semiconductor devices?

Original Abstract Submitted

Embodiments disclosed herein include semiconductor dies and methods of forming such dies. In an embodiment, the semiconductor die comprises a semiconductor substrate, an active device layer in the semiconductor substrate, where the active device layer comprises one or more transistors, an interconnect layer over a first surface of the active device layer, a first bonding layer over a surface of the semiconductor substrate, a second bonding layer secured to the first bonding layer, and a heat spreader attached to the second bonding layer.