18612648. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18612648 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract includes a first substrate with patterns, a semiconductor chip with a metal layer and circuit structure, and first bumps connecting the substrate and chip.
- The first pattern on the substrate contains a ground or power pattern, with the substrate overlapping the circuit structure vertically.
- The first bumps are located near the circuit structure on the substrate's surface, with an elongated shape parallel to the adjacent side of the circuit structure.
Potential Applications: - This technology can be used in various electronic devices that require efficient electrical connections between substrates and semiconductor chips. - It can be applied in the manufacturing of advanced integrated circuits and microprocessors.
Problems Solved: - Provides a reliable and efficient method for connecting semiconductor chips to substrates. - Ensures proper grounding and power distribution within electronic devices.
Benefits: - Improved electrical connectivity and signal transmission. - Enhanced performance and reliability of electronic devices.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Connectivity This technology can be utilized in the production of high-performance computers, smartphones, and other electronic devices, improving their overall functionality and reliability.
Prior Art: Researchers can explore prior patents related to semiconductor packaging technologies, especially those focusing on bump connections and substrate designs.
Frequently Updated Research: Researchers are continually developing new methods to enhance the efficiency and reliability of semiconductor packaging technologies. Stay updated on the latest advancements in the field to incorporate cutting-edge solutions into future designs.
Questions about Semiconductor Packaging Technology: 1. How does the elongated shape of the first bumps contribute to the overall performance of the semiconductor package? - The elongated shape of the first bumps allows for a more secure and stable connection between the substrate and semiconductor chip, improving electrical conductivity and signal transmission. 2. What are the key factors to consider when designing a semiconductor package with efficient electrical connections? - Design considerations include the placement of bumps, the layout of patterns on the substrate, and the alignment of the circuit structure to ensure optimal connectivity and performance.
Original Abstract Submitted
Provided is a semiconductor package including a first substrate, a first pattern and a second pattern disposed on the first substrate, a semiconductor chip disposed on the first substrate and including a metal layer, a circuit structure disposed on the metal layer of the semiconductor chip, and a plurality of first bumps disposed between the first substrate and the semiconductor chip and electrically connected to the first pattern, wherein the first pattern includes a ground pattern or a power pattern, the first substrate includes a first region overlapping the circuit structure in a vertical direction, the plurality of first bumps are disposed adjacent to the first region on a top surface of the first substrate, and a first bump of the plurality of first bumps has an elongated shape substantially parallel to an adjacent side of the first region.
