18612474. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Kihong Jeong of Jeonju-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18612474 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application includes a package substrate, a processor chip mounted on the package substrate, a first stack structure with a number M of memory chips stacked on the processor chip, and a second stack structure with a number N of memory chips stacked on the package substrate.
- The number of channels connecting the memory chips of the second stack structure with the processor chip may be greater than the number of channels connecting the memory chips of the first stack structure with the processor chip.
- The number of memory chips in the second stack structure may be greater than the number of memory chips in the first stack structure.
Potential Applications: - High-performance computing systems - Data centers - Artificial intelligence applications
Problems Solved: - Increased memory capacity in a compact form factor - Enhanced data processing speed and efficiency
Benefits: - Improved overall system performance - Higher memory capacity without increasing footprint - Enhanced data processing capabilities
Commercial Applications: Title: "Advanced Semiconductor Package for High-Performance Computing" This technology can be utilized in high-performance computing systems, data centers, and artificial intelligence applications to enhance memory capacity and data processing speed, leading to improved overall system performance and efficiency.
Questions about the technology: 1. How does the increased number of memory chips in the second stack structure impact data processing speed? 2. What are the potential cost implications of implementing this advanced semiconductor package in commercial applications?
Original Abstract Submitted
A semiconductor package includes a package substrate, a processor chip mounted on the package substrate, a first stack structure on the package substrate, the first stack structure including a number M of memory chips stacked on the processor chip, and a second stack structure on the package substrate and spaced apart from the processor chip, the second stack structure including a number N of memory chips stacked on the package substrate. A number Q of channels that electrically connect the memory chips of the second stack structure with the processor chip may be greater than a number P of channels that electrically connect the memory chips of the first stack structure with the processor chip, or the number N of memory chips included in the second stack structure may be greater than the number M of memory chips included in the first stack structure.
