18610619. METHODS FOR PROCESSING A SEMICONDUCTOR SUBSTRATE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
METHODS FOR PROCESSING A SEMICONDUCTOR SUBSTRATE
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Yu-Hsiang Cheng of Hsinchu (TW)
METHODS FOR PROCESSING A SEMICONDUCTOR SUBSTRATE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18610619 titled 'METHODS FOR PROCESSING A SEMICONDUCTOR SUBSTRATE
The present disclosure pertains to methods of processing a semiconductor substrate in a processing chamber, such as a chemical vapor deposition chamber. The chamber includes a spindle mechanism that works with carrier ring forks to move the substrate between stations. The methods involve monitoring spindle operation parameters and performing maintenance steps on the spindle mechanism based on the monitored parameters, which indicate undesirable vibration of the substrates in the chamber. This vibration leads to the generation of unwanted particles that can deposit on the substrate surface.
- Spindle mechanism in a chemical vapor deposition chamber moves semiconductor substrates between stations.
- Monitoring spindle operation parameters to detect undesirable vibration of substrates.
- Performing maintenance steps on the spindle mechanism based on monitored parameters.
- Preventing the generation of unwanted particles that can deposit on the substrate surface.
- Enhancing the quality of semiconductor processing by reducing vibration-induced particle contamination.
Potential Applications: - Semiconductor manufacturing - Chemical vapor deposition processes - Cleanroom technology
Problems Solved: - Minimizing vibration-induced particle contamination on semiconductor substrates - Improving the quality and yield of semiconductor processing
Benefits: - Enhanced semiconductor processing quality - Reduced particle contamination - Increased yield and efficiency in manufacturing processes
Commercial Applications: Title: Semiconductor Substrate Processing Technology for Enhanced Yield and Quality This technology can be applied in semiconductor manufacturing facilities to improve the quality and yield of processed substrates. It can also benefit companies involved in chemical vapor deposition processes and cleanroom technology by reducing particle contamination and enhancing overall efficiency.
Questions about Semiconductor Substrate Processing Technology: 1. How does vibration affect the quality of semiconductor processing? Vibration can lead to the generation of unwanted particles that deposit on the substrate surface, reducing the quality of semiconductor processing.
2. What are the key benefits of monitoring spindle operation parameters in semiconductor processing? Monitoring spindle operation parameters helps in detecting and addressing undesirable vibration, leading to reduced particle contamination and improved processing quality.
Original Abstract Submitted
The present disclosure relates to methods of processing a semiconductor substrate in a processing chamber, such as a chemical vapor deposition chamber. The chemical vapor deposition chamber includes a spindle mechanism that cooperates with one or more carrier ring forks to move the semiconductor substrate from one station to another station. The methods include monitoring one or more spindle operation parameters and carrying out one or more maintenance steps on the spindle mechanism based on the results of monitoring the one or more spindle operation parameters. The monitored spindle operation parameters provide an indication of undesirable vibration of the semiconductor substrates in the processing chamber. The vibration of the semiconductor substrates in the processing chamber is undesirable because it promotes generation of unwanted particles that deposit onto a surface of the semiconductor substrate.
