18610464. ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)

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ELECTRONIC COMPONENT

Organization Name

Murata Manufacturing Co., Ltd.

Inventor(s)

Togo Matsui of Nagaokakyo-shi (JP)

ELECTRONIC COMPONENT - A simplified explanation of the abstract

This abstract first appeared for US patent application 18610464 titled 'ELECTRONIC COMPONENT

The patent application describes an electronic component with a multilayer body containing inner electrodes, dielectric layers, and outer electrodes connected to the inner electrodes. The outer electrodes are positioned on the side surfaces of the multilayer body and are connected to the inner electrodes internally.

  • The electronic component features a multilayer body with inner and outer electrodes.
  • Dielectric layers are alternately stacked between the inner electrodes.
  • Outer electrodes are directly connected to the inner electrodes internally.
  • The multilayer body has main, side, and end surfaces in different directions.
  • The outer electrodes are located on the side surfaces of the multilayer body.

Potential Applications: - This technology can be used in electronic devices such as capacitors and filters. - It can enhance the performance and efficiency of electronic circuits. - The multilayer body design allows for compact and space-saving electronic components.

Problems Solved: - Provides a more efficient and reliable connection between inner and outer electrodes. - Enhances the overall performance and functionality of electronic components. - Allows for better integration of components in electronic devices.

Benefits: - Improved connectivity and electrical performance. - Space-saving design for compact electronic devices. - Enhanced reliability and durability of electronic components.

Commercial Applications: Title: Advanced Electronic Components for Enhanced Circuit Performance This technology can be applied in the manufacturing of capacitors, filters, and other electronic components for various industries such as telecommunications, automotive, and consumer electronics. The compact design and improved connectivity offer significant advantages in enhancing circuit performance and overall device efficiency.

Questions about Electronic Components: 1. How does the multilayer body design improve the performance of electronic components? The multilayer body design enhances connectivity and efficiency by providing a direct connection between inner and outer electrodes internally. 2. What are the potential applications of this technology in different industries? This technology can be utilized in various industries such as telecommunications, automotive, and consumer electronics to enhance circuit performance and reliability.


Original Abstract Submitted

An electronic component includes a multilayer body including inner electrodes and dielectric layers that are alternately stacked, and outer electrodes that are electrically connected to the inner electrodes. The multilayer body includes first and second main surfaces opposite each other in a stacking direction, first and second side surfaces opposite each other in a width direction, and first and second end surfaces opposite each other in a length direction. At least one of the outer electrodes is located on at least one of the first side surface or the second side surface of the multilayer body and is directly connected to the inner electrodes at positions spaced away from the at least one of the first side surface or the second side surface toward the inside of the multilayer body.

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