18609067. SUBSTRATE SUPPORT DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SUBSTRATE SUPPORT DEVICE
Organization Name
Inventor(s)
SUBSTRATE SUPPORT DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18609067 titled 'SUBSTRATE SUPPORT DEVICE
The patent application describes a substrate support device with various components such as a chuck plate, a shaft, a heater unit, an electrode unit, a jumper unit, and a power control unit.
- Chuck plate with a shaft connected to the center lower end for support.
- Heater unit and electrode unit provided inside the chuck plate for heating and electrical purposes.
- Jumper unit electrically connected to the electrode unit to supply power.
- Electrode unit consists of a center electrode and a first electrode in a ring shape.
- Jumper unit includes a first jumper connected to the first electrode and a center jumper connected to the center electrode.
Potential Applications: - Semiconductor manufacturing processes - Thin film deposition - Plasma etching processes
Problems Solved: - Efficient heating and electrical supply to the substrate - Precise control of temperature and electrical properties
Benefits: - Improved substrate processing efficiency - Enhanced control over substrate properties - Increased yield and quality of manufactured products
Commercial Applications: Title: "Advanced Substrate Support Device for Semiconductor Manufacturing" This technology can be used in semiconductor fabrication facilities to enhance the production process, leading to higher quality and yield of semiconductor products. The market implications include improved competitiveness and efficiency in the semiconductor industry.
Prior Art: Readers can explore prior patents related to substrate support devices in semiconductor manufacturing to understand the evolution of this technology and potential areas for improvement.
Frequently Updated Research: Stay updated on advancements in substrate support devices for semiconductor manufacturing to leverage the latest innovations in the field.
Questions about Substrate Support Devices: 1. How does the jumper unit contribute to the overall functionality of the substrate support device? The jumper unit plays a crucial role in supplying power to the electrode unit, ensuring efficient heating and electrical properties during substrate processing.
2. What are the key differences between this substrate support device and traditional methods of substrate heating and electrical supply? This substrate support device offers improved control and efficiency in heating and electrical supply compared to conventional methods, leading to enhanced substrate processing capabilities.
Original Abstract Submitted
A substrate support device includes a chuck plate, a shaft connected to a center lower end of the chuck plate, a heater unit provided inside the chuck plate, an electrode unit provided inside the chuck plate, and provided on the heater unit, a jumper unit provided inside the chuck plate, arranged between the electrode unit and the heater unit, and electrically connected to the electrode unit to supply power to the electrode unit, and a power control unit, wherein the electrode unit includes a center electrode and a first electrode arranged in a ring shape around the center electrode, wherein the jumper unit includes a first jumper connected to the first electrode and a center jumper connected to the center electrode, and wherein the first jumper includes a first connection jumper, and a first inclined jumper electrically connecting the first jumper.
