18609063. DISPLAY DEVICE AND SEMICONDUCTOR SUBSTRATE simplified abstract (Japan Display Inc.)
Contents
DISPLAY DEVICE AND SEMICONDUCTOR SUBSTRATE
Organization Name
Inventor(s)
DISPLAY DEVICE AND SEMICONDUCTOR SUBSTRATE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18609063 titled 'DISPLAY DEVICE AND SEMICONDUCTOR SUBSTRATE
The semiconductor substrate in this patent application includes a switching element, a first organic insulating film, first and second metal lines, and a metal electrode.
- The first organic insulating film has two surfaces, with the switching element covered by the first surface and the metal lines and electrode located on the second surface.
- The first metal line has a portion extending in one direction and a wider portion with arcuate edges.
- The metal electrode has a polygonal or elliptic shape with more than four corners.
Potential Applications: - This technology could be used in the manufacturing of advanced semiconductor devices. - It may find applications in the development of high-performance electronic components.
Problems Solved: - This innovation addresses the need for efficient and reliable semiconductor substrates. - It provides a solution for optimizing the layout and design of metal lines and electrodes in semiconductor devices.
Benefits: - Improved performance and reliability of semiconductor devices. - Enhanced efficiency in the production process of electronic components.
Commercial Applications: Title: Advanced Semiconductor Substrate Technology for Enhanced Device Performance This technology could be utilized in the production of smartphones, tablets, and other consumer electronics. It may also have applications in the automotive industry for advanced driver assistance systems.
Questions about the Technology: 1. How does this semiconductor substrate technology improve the performance of electronic devices? 2. What are the potential challenges in implementing this innovation in mass production processes?
Frequently Updated Research: Stay updated on the latest advancements in semiconductor substrate technology to ensure the continued relevance and competitiveness of this innovation.
Original Abstract Submitted
According to one embodiment, a semiconductor substrate including, a switching element, a first organic insulating film, first and second metal lines arranged in a first direction and extending in a second direction, and a metal electrode located between the first and second metal lines. The first organic insulating film includes first and second surfaces. The switching element is covered with the first surface. The first and second metal lines and the metal electrode are located on the second surface side. The first metal line includes a first portion extending in the second direction and a second portion having a width larger than a width of the first portion. The second portion includes arcuate first and second edge. The metal electrode has a polygonal shape having n corners or an elliptic shape where n is larger than four.
