18608868. SEMICONDUCTOR ASSEMBLIES USING EDGE STACKING AND METHODS OF MANUFACTURING THE SAME simplified abstract (MICRON TECHNOLOGY, INC.)

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SEMICONDUCTOR ASSEMBLIES USING EDGE STACKING AND METHODS OF MANUFACTURING THE SAME

Organization Name

MICRON TECHNOLOGY, INC.

Inventor(s)

Thomas H. Kinsley of Boise ID (US)

SEMICONDUCTOR ASSEMBLIES USING EDGE STACKING AND METHODS OF MANUFACTURING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18608868 titled 'SEMICONDUCTOR ASSEMBLIES USING EDGE STACKING AND METHODS OF MANUFACTURING THE SAME

Simplified Explanation: This patent application discloses semiconductor assemblies and packages utilizing edge stacking, with connectors for electrical coupling to neighboring packages or circuits.

  • The semiconductor package includes a base substrate with one or more dies attached and encapsulated by a mold material.
  • Connectors on the side surface of the package electrically couple to the base substrate and/or dies.
  • The connectors can also link the package to neighboring semiconductor packages or electrical circuits.

Key Features and Innovation:

  • Utilization of edge stacking in semiconductor assemblies and packages.
  • Connectors for electrical coupling to neighboring packages or circuits.
  • Mold material encapsulation for protection and durability.

Potential Applications:

  • Semiconductor industry for electronic devices.
  • Integrated circuits and microelectronics.
  • Consumer electronics and automotive electronics.

Problems Solved:

  • Improved electrical coupling in semiconductor packages.
  • Enhanced protection and durability for semiconductor assemblies.
  • Facilitates connectivity between multiple semiconductor packages.

Benefits:

  • Enhanced electrical performance.
  • Increased durability and protection.
  • Improved connectivity and versatility in semiconductor packages.

Commercial Applications:

  • Semiconductor manufacturing industry for electronic devices.
  • Consumer electronics market for smartphones, tablets, and laptops.
  • Automotive industry for vehicle electronics and control systems.

Prior Art: Prior art related to this technology can be found in patents and publications related to semiconductor packaging, edge stacking, and electrical connectors in electronic devices.

Frequently Updated Research: Ongoing research in semiconductor packaging technologies, edge stacking methods, and connector design for improved electrical coupling in electronic devices.

Questions about Semiconductor Assemblies and Packages using Edge Stacking: 1. What are the key features of semiconductor assemblies utilizing edge stacking? 2. How do connectors in these packages facilitate electrical coupling to neighboring packages or circuits?


Original Abstract Submitted

Semiconductor assemblies and packages using edge stacking and associated systems and methods are disclosed herein. A semiconductor package may include (1) a base substrate having a base surface, (2) one or more dies attached over the base surface, and (3) a mold material encapsulating the base substrate and the one or more dies. The package may further include connectors on a side surface thereof, wherein the connectors are electrically coupled to the base substrate and/or the one or more dies. The connectors may be further configured to electrically couple the package to one or more neighboring semiconductor packages and/or electrical circuits.

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