18608204. SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM simplified abstract (Kokusai Electric Corporation)
SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM
Organization Name
Inventor(s)
Kazuyuki Toyoda of Toyama (JP)
Atsushi Umekawa of Toyama (JP)
Makoto Kawabata of Toyama (JP)
SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM - A simplified explanation of the abstract
This abstract first appeared for US patent application 18608204 titled 'SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM
Simplified Explanation: The patent application describes a technique for uniformly processing a substrate quickly by providing an adequate amount of active species to the substrate's surface.
Key Features and Innovation:
- Process chamber, discharge chamber, plasma source, exhaust system, and process gas supply system included in the substrate processing apparatus.
- Control unit manages the plasma source, exhaust system, and process gas supply system to intermittently supply process gas from a temporary storage unit to the discharge chamber.
- Activated process gas is then supplied from the discharge chamber to the process chamber with lower inner pressure.
Potential Applications: This technology can be used in semiconductor manufacturing, surface treatment of materials, and thin film deposition processes.
Problems Solved: This innovation addresses the challenge of achieving uniform substrate processing within a short time frame by efficiently supplying active species to the substrate's surface.
Benefits:
- Improved processing efficiency
- Enhanced uniformity in substrate treatment
- Reduced processing time
Commercial Applications: The technology can be applied in the production of electronic devices, solar panels, and other high-tech industries where precise substrate processing is essential for product quality.
Questions about the Technology: 1. How does this technique compare to traditional substrate processing methods? 2. What are the potential cost savings associated with implementing this technology?
Frequently Updated Research: Ongoing research in this field focuses on optimizing the process parameters for different types of substrates and exploring new applications in emerging industries.
Original Abstract Submitted
Provided is a technique of uniformly processing a substrate within a short time by supplying a sufficient amount of active species to a surface of the substrate. A substrate processing apparatus includes: a process chamber; a discharge chamber; a plasma source; an exhaust system; a process gas supply system including a temporary storage unit; and a control unit configured to control the plasma source, the exhaust system and the process gas supply system to: intermittently supply a process gas temporarily stored in the temporary storage unit into the discharge chamber; and supply the process gas activated in the discharge chamber from the discharge chamber into the process chamber having an inner pressure lower than an inner pressure of the discharge chamber.
