18607941. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18607941 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract includes a semiconductor chip, a pad structure connected to the chip, a solder ball in contact with the pad structure, and an insulating layer between the chip and the pad structure.
- The insulating layer features a ring-shaped groove surrounding the pad structure, spaced apart from it.
- The solder ball is positioned in a first direction away from the semiconductor chip.
- The insulating layer ensures electrical isolation and protection for the semiconductor chip and pad structure.
- The design enhances the reliability and performance of the semiconductor package.
- The ring-shaped groove in the insulating layer provides additional structural support and stability.
Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and laptops. - It is suitable for applications requiring high reliability and performance in harsh environments.
Problems Solved: - Ensures electrical isolation and protection for the semiconductor chip and pad structure. - Enhances the reliability and performance of the semiconductor package.
Benefits: - Improved reliability and performance of electronic devices. - Enhanced structural support and stability for semiconductor packages.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Reliability This technology can be utilized in the consumer electronics industry for manufacturing high-performance electronic devices with improved reliability. It can also be beneficial in the automotive industry for applications requiring durable and robust semiconductor packages.
Questions about Semiconductor Package Technology: 1. How does the insulating layer contribute to the reliability of the semiconductor package? The insulating layer provides electrical isolation and protection for the semiconductor chip and pad structure, enhancing the overall reliability of the package.
2. What are the potential market implications of implementing this advanced semiconductor packaging technology? By incorporating this technology, manufacturers can produce electronic devices with improved reliability and performance, leading to increased customer satisfaction and market competitiveness.
Original Abstract Submitted
Provided is a semiconductor package including a semiconductor chip, a pad structure electrically connected to the semiconductor chip, a solder ball spaced apart from the semiconductor chip in a first direction and in contact with the pad structure, and an insulating layer arranged between the semiconductor chip and the pad structure and in contact with the pad structure, wherein the insulating layer includes a first ring-shaped groove having a ring shape surrounding the pad structure, and the first ring-shaped groove is spaced apart from the pad structure.
