18606534. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Hyeongmun Kang of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18606534 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract includes a first semiconductor chip with multiple second semiconductor chips stacked on top, conductive front pads on the lower surfaces of the second chips, conductive rear pads on the upper surfaces of all chips, first and second bonding pads in different regions, and chip connection terminals between the front and rear pads. Each second bonding pad has a supporting part to hold the chip connection terminals and a fixing part protruding from its upper surface.
- First semiconductor chip with stacked second semiconductor chips
- Conductive front pads on lower surfaces of second chips
- Conductive rear pads on upper surfaces of all chips
- First and second bonding pads in different regions
- Chip connection terminals between front and rear pads
- Second bonding pads with supporting and fixing parts
Potential Applications: - Advanced semiconductor packaging technology - High-density integrated circuits - Miniaturized electronic devices
Problems Solved: - Improved connectivity in stacked semiconductor chips - Enhanced reliability and performance in electronic devices
Benefits: - Increased efficiency in semiconductor packaging - Greater functionality in compact electronic devices - Enhanced overall performance of integrated circuits
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for High-Density Integrated Circuits This technology can be utilized in various industries such as consumer electronics, telecommunications, automotive, and aerospace for developing compact and high-performance electronic devices.
Questions about Semiconductor Packaging Technology: 1. How does the configuration of the second bonding pads improve connectivity in the semiconductor package? 2. What are the potential challenges in implementing this advanced semiconductor packaging technology in mass production?
Frequently Updated Research: Researchers are continuously exploring new materials and manufacturing processes to further enhance the performance and reliability of semiconductor packaging technologies. Stay updated on the latest advancements in the field to leverage the full potential of this innovation.
Original Abstract Submitted
Provided is a semiconductor package including a first semiconductor chip, a plurality of second semiconductor chips sequentially stacked on the first semiconductor chip, a plurality of conductive front pads on lower surfaces of the plurality of second semiconductor chips, a plurality of conductive rear pads attached to an upper surface of the first semiconductor chip and an upper surface of each of the plurality of second semiconductor chips, and including a plurality of first bonding pads and a plurality of second bonding pads in different regions, and a plurality of chip connection terminals between the plurality of conductive front pads and the plurality of conductive rear pads, wherein each of the plurality of second bonding pads includes a supporting part configured to support each of the plurality of chip connection terminals, and a fixing part protruding from an upper surface of the supporting part.
