18606213. ELECTROSTATIC CHUCK AND PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
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ELECTROSTATIC CHUCK AND PLASMA PROCESSING APPARATUS
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ELECTROSTATIC CHUCK AND PLASMA PROCESSING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18606213 titled 'ELECTROSTATIC CHUCK AND PLASMA PROCESSING APPARATUS
The abstract describes an electrostatic chuck with a substrate support, an electrostatic electrode, and an electrode on a different plane, with a through-hole in the substrate support.
- The electrostatic chuck supports a substrate or an edge ring.
- An electrostatic electrode clamps the substrate or edge ring.
- An electrode on a different plane is located between the electrostatic electrode and the through-hole.
- The substrate support has a through-hole from the upper surface to the lower surface.
- The electrode is at least partially located between the electrostatic electrode and the through-hole.
Potential Applications: - Semiconductor manufacturing - Flat panel display production - Thin film deposition processes
Problems Solved: - Secure clamping of substrates - Enhanced stability during manufacturing processes
Benefits: - Improved precision in manufacturing - Increased efficiency in production processes - Reduced risk of substrate damage
Commercial Applications: Title: Advanced Electrostatic Chuck Technology for Semiconductor Manufacturing This technology can be used in semiconductor fabrication facilities to improve substrate handling and processing efficiency, leading to higher quality products and increased productivity in the industry.
Prior Art: Prior art related to this technology may include patents or research papers on electrostatic chuck designs, substrate handling in manufacturing processes, and semiconductor fabrication equipment.
Frequently Updated Research: Researchers may be investigating new materials for substrate supports, optimizing electrode configurations for better clamping performance, and exploring applications of electrostatic chucks in emerging technologies.
Questions about Electrostatic Chuck Technology: 1. How does the electrode configuration impact the clamping performance of the electrostatic chuck? 2. What are the potential challenges in scaling up this technology for mass production in semiconductor manufacturing?
Original Abstract Submitted
An electrostatic chuck includes a substrate support to support at least one of a substrate or an edge ring, an electrostatic electrode inside the substrate support to electrostatically clamp at least one of the substrate or the edge ring, and an electrode inside the substrate support and located on a plane different from a plane on which the electrostatic electrode is located. The substrate support has a through-hole extending through the substrate support from an upper surface of the substrate support to a lower surface of the substrate support. The electrode is at least partially located between the electrostatic electrode and the through-hole.
