18605956. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18605956 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application includes a first substrate, a first chip structure, a second chip structure, an underfill material layer, and a first protrusion.
- The first chip structure is positioned vertically above the first substrate.
- The second chip structure is located above the first substrate, separated from the first chip structure in a horizontal direction.
- An underfill material layer is placed between the second chip structure and the first substrate.
- A first protrusion extends from the first substrate vertically and horizontally along at least one side surface of the underfill material layer.
Potential Applications: This technology can be used in various semiconductor packaging applications where precise positioning and spacing of chip structures are crucial.
Problems Solved: The technology addresses the need for improved thermal management and mechanical stability in semiconductor packaging.
Benefits: Enhanced reliability and performance of semiconductor devices due to improved thermal dissipation and mechanical support.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Performance This technology can be applied in the manufacturing of high-performance electronic devices such as smartphones, computers, and automotive electronics.
Questions about Semiconductor Packaging Technology: 1. How does the first protrusion improve the mechanical stability of the semiconductor package? The first protrusion provides additional support and reinforcement to the underfill material layer, enhancing the overall mechanical stability of the package.
2. What are the advantages of having the second chip structure spaced apart from the first chip structure in a horizontal direction? The spacing between the chip structures allows for better thermal management and reduces the risk of interference between the components.
Original Abstract Submitted
A semiconductor package includes a first substrate; a first chip structure disposed above the first substrate in a vertical direction; a second chip structure disposed above the first substrate and spaced apart from the first chip structure in a first horizontal direction perpendicular to the vertical direction; an underfill material layer disposed between the second chip structure and the first substrate; and a first protrusion extending from the first substrate in the vertical direction and extending in a second horizontal direction perpendicular to the vertical direction and the first horizontal direction along at least one side surface of the underfill material layer, where a side surface of the first protrusion contacts the underfill material layer.
